Electronics Forum | Wed Jun 23 18:23:32 EDT 1999 | Tom B.
Even though you may find a pad-pad thru-hole spacing, part body size, orientation, and insertion head tooling clearences may be the deciding factor in spacing. 1. Part body diameter will dictate component centroid spacing. ---[][][][
Electronics Forum | Wed Jun 23 15:49:30 EDT 1999 | Kelly Morris
In the IPC-SM-782 (Surface Mount Design and Land Pattern Standard) it recommends a minimum of .040" between bottomside wavesoldered chip pads. Where might I find a similar IPC recommendation for minimum space between thru-hole pads? Does anyone kno
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Blackfox Training Institute, LLC | https://www.blackfox.com/ipc-certification/ipc-instructor/ipc-77117721-cit-recertification/
: IPC 7711/7721 manual Instructor notes for training CIS students Access to training materials including visuals and forms To be eligible for recertification, the CIT must have certified a minimum of 5
| https://www.eptac.com/faqs/ask-helena-leo/ask/smt-components-during-reflow-float-off-pads
(adequate side joint length, not violating minimum electrical clearance, etc.). The IPC does not stipulate that the heel needs to be on pad
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