Industry Directory | Manufacturer
Thermally Managed ( up to 1000 W /m K thermal transfer rate ), CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology
Industry Directory | Consultant / Service Provider
G2 provides a complete, integrated, cloud-based solution that increases manufacturers' visibility, control and recovery of revenue.
STABLCOR� is a Thermally Managed PCB / Substrate material technology with many benefits: High Thermal Conductivity with a product family that ranges from 100 W/m K up to 1000 W/m K Can more closely match the CTE mismatch that is common today bet
New Equipment | Test Equipment
Agilent 86105A-202 20GHz Electrical/20GHz Optical Plug-In Module The Agilent 86105A incorporates two measurement channels -- one optical, the second electrical. Each channel has two selectable bandwidth settings. In the lower bandwidth mode of 12
Electronics Forum | Thu Sep 14 14:37:45 EDT 2000 | Serrena Carter
Does anyone know where I can find good rule of thumb information on soldering/brazing. I am most interested learning the maximum recommended CTE mismatch between two different materials that thermally cycle between 25-100C.
Electronics Forum | Wed Feb 07 18:40:39 EST 2007 | bill
What is an acceptable mismatch for smt components and pcb. We are having cracked solder joints from fatigue after repeated thermal cycling 25 deg. c to 125 deg.c.
Used SMT Equipment | In-Circuit Testers
Description The E5061B-010 time domain/fault location analysis option allows you to locate the discontinuities and mismatches of devices such as cables. By employing the gating function in the time domain and transforming the data back to the freque
Used SMT Equipment | In-Circuit Testers
Agilent E4412A The Agilent E4412A diode power sensor, with wide dynamic range, is designed for use with the EPM and EPM-P series power meters for power measurements on CW signals from 10 MHz to 18 GHz. The E4412A power sensor provides extremely l
Industry News | 2019-04-30 17:39:40.0
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor an amazing Chapter Tutorial Program. The tutorial will be held on June 11 and showcase the latest technologies, designs and reliability trends.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Technical Library | 2020-01-01 17:06:52.0
The majority of electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials.CTE mismatches occur in both 1st and 2nd level interconnects in electronics assemblies. 1st level interconnects connect the die to a substrate. This substrate can be underfilled so there are both global and local CTE mismatches to consider. 2nd level interconnects connect the substrate, or package, to the printed circuit board (PCB). This would be considered a "board level" CTE mismatch. Several stress and strain mitigation techniques exist including the use of conformal coating.
Technical Library | 2008-11-13 00:06:32.0
The electronics industry is facing issues with hot spots, solder joint stresses and Coefficient of Thermal Expansion (CTE) mismatch between PCB and IC substrate. Flip chip type packages for example have very low CTE compared to traditional PCB material. Thus it is necessary to have low CTE printed circuit boards in order to keep solder joint intact with such low CTE packages. There are currently several materials available in the market to address thermal and CTE challenges but each material has its own advantages and limitations...
There is SPI for Screen Printing. AOI for Pick and Place. Now there is RPI (Reflow Process Inspection) for the Reflow Oven. KIC's RPI provides production reports such as yield analysis, DPMO, Pareto Charts, Cpk and much much more. When RPI is use
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. There is a mismatch between the plating layer material and the applied solder paste. For 0201 and 01005 sized chips, since the amount of printed solder paste is thinner, the flux in the solder paste evaporates more quickly thus affecting the wetting properties of solder paste when
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
Component Contamination Board Contamination Pad Size Mismatch Cause Open Joint DEFECT Tombstoning Voids Solder Wicking Non-Wetting Incomplete Fillets Poor Strength Solder Shorts Solder Balls
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