Electronics Forum: misregistration of solder paste deposits (19)

Thickness of solder paste from stencil

Electronics Forum | Thu Apr 11 04:03:28 EDT 2002 | mwoodall

The Alpha metals Hi Check 500 is used to measure paste deposit thickness. The paste height is found from a micrometer reading determined by focussing a beam of light on a track adjacent to a paste deposit and then onto the solder paste. I've measure

Thickness of solder paste from stencil

Electronics Forum | Wed Apr 10 22:46:04 EDT 2002 | davef

On SMTnet, we've discussed the the frailties of controlling paste height, when volume is a more telling measure. Sometimes if you seperate too quickly, the paste tries to stay attached to the aperture walls. This creates a 'U' shaped deposit with r

Industry News: misregistration of solder paste deposits (30)

MIRTEC to Exhibit Award-Winning Line of 3D AOI and SPI Inspection Systems at SMTAI 2013

Industry News | 2013-09-13 17:01:33.0

MIRTEC, “The Global Leader in Inspection Technology”, will exhibit its award-winning line of 3D AOI and SPI Inspection Systems at SMTAI 2013 booth #722. This three-day event is scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of 3D AOI and SPI Inspection Systems at IPC APEX 2014

Industry News | 2014-02-17 20:17:14.0

MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, and SPI Inspection Systems at IPC APEX 2014 booth #2263.

MIRTEC Corp

Technical Library: misregistration of solder paste deposits (12)

BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

Technical Library | 2007-02-01 09:57:15.0

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.

BEST Inc.

Quantitative Evaluation of New SMT Stencil Materials

Technical Library | 2011-06-29 14:44:52.0

High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase, so do the challenges of maintaining a successful solder paste deposition process. To help assemblers address

Shea Engineering Services

Videos: misregistration of solder paste deposits (1)

This animation shows the overview of programming and running of a MYDATA MY500 Jet Printing machine.

This animation shows the overview of programming and running of a MYDATA MY500 Jet Printing machine.

Videos

This animation shows the overview of programming and running of a MYDATA MY500 Jet Printing machine. Check the ''Jet Printing in detail'' video to see how Jet Printing works

Mycronic Technologies AB

Express Newsletter: misregistration of solder paste deposits (1015)

Partner Websites: misregistration of solder paste deposits (1840)

What is the parameter debugging skills of the Full-auto SMT Stencil Printer? - I.C.T SMT Machine

| https://www.smtfactory.com/What-is-the-parameter-debugging-skills-of-the-Full-auto-SMT-Stencil-Printer-id3338478.html

. The maximum opening length of the stencil of Full-auto SMT Stencil Printer is 30~50mm on each side. In order to reduce the amount of solder paste added and the contact area between the solder paste and air, the length of the squeegee is smaller

The PCB Assembly Process: How Does It Work?

Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-assembly-how-does-it-work/

! During the PCB assembly process, the solder mask stays behind, making the circuit board appear green. Today’s assembly of PCBs has come a long way, and if you positively want to know more about it

Imagineering, Inc.


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