Industry Directory | Manufacturer
S.B.TECHNOLOGIES provides Electronics Manufacturing Services with 0402 CHIP SMT Assembly,BGA, Thru-Hole PCB Assembly, Wave Soldering, Reflow Soldering, Mixed Technology Printed Circuit Board Assembly build to IPC-Workmanship Stand
Industry Directory | Manufacturer
IVAS Tech is a manufacturer of high mix-low volume SMT equipment. Our latest product is HBSM for fully automated simultaneously assembly and soldering of Luxeon lighting Emitters.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
New Equipment | Education/Training
BEST training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature ".062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This board feature
Used SMT Equipment | Soldering - Wave
Vitronics Wave Soldering Machine Model: Delta 6622C Vintage: 2006 Lead-Free (SN100C) Internal Dual Spray Fluxer (2) Bottom-Side Convection Preheat Zones (1) Bottom-Side Cal Rod Preheat Zone (1) Top-Side IR Preheat Zone Cast Iron Solder Pot Mix of L a
Used SMT Equipment | Soldering Equipment/Fluxes
The Opus 3 is a four-axis Cartesian Robot designed specifically for selectively soldering through-hole and odd-form components into surface-mount and mixed-technology printed circuit boards from the bottom side without inverting the PCB. The Opus 3 w
Industry News | 2012-09-13 09:35:40.0
GPD Global will exhibit in Booth #435 at the upcoming SMTA International Conference and Expo,
Industry News | 2012-06-11 12:24:54.0
GPD Global announces that it will exhibit in Booth #6085 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.
Technical Library | 2023-09-26 19:14:44.0
The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are becoming commonplace in electronic assemblies. For example, area array components (BGA/CSP) are frequently available only with lead free Sn-Ag-Cu (SAC) solder balls. Such parts are often assembled to printed circuit boards using traditional 63Sn-37Pb solder paste. The resulting solder joints contain unusual quaternary alloys of Sn, Ag, Cu, and Pb. In addition, the alloy composition can vary across the solder joint based on the paste to ball solder volumes and the reflow profile utilized. The mechanical and physical properties of such Sn-Ag-Cu-Pb alloys have not been explored extensively in the literature. In addition, the reliability of mixed formulation solder joints is poorly understood.
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Training Courses | ON DEMAND | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | ON DEMAND | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Oct 19 18:30:00 UTC 2021 - Tue Oct 19 18:30:00 UTC 2021 | ,
Penang Chapter Virtual Vendor & Technical Day
Events Calendar | Mon Feb 17 18:30:00 UTC 2020 - Mon Feb 17 18:30:00 UTC 2020 | ,
Corrosion Testing For Electronic Equipment
Career Center | Kirkland, Portsmouth N.H Canada | Quality Control
Contract Electronic Manufacturer of PCB Assemblies seeks experienced QA Inspector with CLUSO VISION SYSTEMS First Article Inspection experience. Excellent communication skills. Computer literate, strong sense of urgency, and motivated with good follo
Career Center | Seymour, Connecticut USA | Engineering
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a
Career Center | Cochin, Kerala India | Engineering,Management,Production,Technical Support
9 Years Experience in SMT Manufacturing Process, Quality Control Process, Testing and Engineering of Windmill power projects. The experience include: - � Skill in selection and installation of new manufacturing lines. � Conduct and analyze process t
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
SMTnet Express, November 19, 2015, Subscribers: 23,763, Members: Companies: 14,760, Users: 39,366 HALT Testing of Backward Soldered BGAs on a Military Product B. Gumpert, B. Fox, L. Woody; Lockheed Martin Corporation The move to lead free (Pb
SMTnet Express, November 3, 2022, Subscribers: 24,938, Companies: 11,645, Users: 27,536 █ Electronics Manufacturing Technical Articles The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible
| https://www.smtfactory.com/Consumables-pl3091858.html
zinc.The most common lead-free mix is tin-copper, which has a melting point of 217°C. Lead-free solders have properties that are distinct from traditional lead-tin mixes. I.C.T
