Industry Directory | Manufacturer
The largest tin/lead secondary smelter in the western hemisphere, with a focus on recycling industrial metal waste streams. Areas of expertise include electronics dross, solder paste, solder wire, solder bar.
New Equipment | Solder Materials
We have a wide variety of flux-Cored solder, a mix of metal alloy, flux and other elements, that we have put together to match every type of application. This formula is designed so that the incidence of bridging is rare; likew
New Equipment | Solder Paste Stencils
Laser Fab, NiPlate™, NanoCoat™. NicAlloy-XT™ stencils are the premier laser-cut stencils in the industry. Beginning life as a laser-cut stencil, followed by a secondary process utilizing Photo Stencil’s own proprietary NiPlate™ technology, which fur
Electronics Forum | Fri Nov 07 08:12:24 EST 2003 | caldon
From my understanding (and I am not a metalurgist)Most Lead free solders can be intercahngeable.The alloy created should be stable. The issue is if you add Leaded solder to the joint. Obviously, research and testing is still pending. cal
Electronics Forum | Sat Jul 29 08:52:09 EDT 2006 | davef
This recipe is nice for leaded soldering. The time above liquidous plus 20*C is too short for mixed alloy soldering. Remember all that nonleaded stuff that you add to the solder acts to increase the liquidous temperature of the alloy. Try slowing
Used SMT Equipment | Soldering - Wave
ERSA EWS 330 Wave Soldering Machine Year 2005 Flushing: Spry Preheating: mix between IR and Quartz Pot: Lead-free, Double Wave Alloy used: SACX PLUS 0307 Wave width: 330 mm Equipped with: 3 Trolleys
Used SMT Equipment | Soldering - Wave
ERSA EWS 330 Wave Soldering Machine Year 2005 Flushing: Spry Preheating: mix between IR and Quartz Pot: Lead-free, Double Wave Alloy used: SACX PLUS 0307 Wave width: 450 mm Equipped with: 3 Trolleys
Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Industry News | 2010-01-22 21:46:55.0
Minneapolis, MN - The SMTA is pleased to announce several new online presentations coming up in February. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.
Technical Library | 2022-10-31 17:25:37.0
Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
ALPHA® Preforms with solder paste adds solder volume.
Universal Chip Programming with Precision Socket Actuator Lever. Precision High Volume Production Manual Programmer– the 2900L is a multisite manual production programmer ideal for volumes from 1K to 500K+ per year. BPM’s 2900L is excellent for small
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
| https://www.feedersupplier.com/sale-13119303-aluminium-alloy-i-pulse-f1-f2-type-smt-feeder-carts.html
Aluminium Alloy I - Pulse F1 F2 Type SMT Feeder Carts Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| https://www.eptac.com/virtual-and-augmented-the-reality-of-mixed-reality/
Virtual and Augmented: The Reality of Mixed Reality - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
