Industry Directory | Manufacturer
Silicone Solutions is a consulting and custom manufacturing firm focusing on silicone product technology.
Industry Directory | Manufacturer
Steiner Elektronik provides high quality tested PCBs, PCB assembly, provision of electronic components, potting and cable confection. ESD protected environment according to ISO 9001 and ISO 14001.
The Vortik® family of progressive cavity pumps (PCP) are fully integrated with our industry-leading dispensing systems and software to deliver repeatable volumetric accuracy without interruption. Benefits Improved productivity – continu
New Equipment | Education/Training
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
Electronics Forum | Thu Feb 11 09:12:46 EST 2010 | blnorman
Have you checked to make sure the mix ratio is correct? My experience with epoxies is that if the mix ratio is off with too much hardener you will get a much higher exotherm than expected. Modulus is high too, pretty stiff material.
Electronics Forum | Sat Nov 11 22:43:50 EST 2006 | KEN
Hey Sr. Tech. Before you get crazy with changing the process or chemistry I would first verify you are using the correct mix ratio. A refractometer can be a useful tool in these cases. I have seen this in the past where the maintenance technician
Used SMT Equipment | Pick and Place/Feeders
ASM Siplace D4i Pick And Place Machine Features: With the SIPLACE D4i, we can provide you with an extremely powerful placement machine with four gantries and four 12-nozzle Collect&Place heads. It is thus a high-speed placement a machine that com
Used SMT Equipment | Pick and Place/Feeders
ASM SIPLACE D1i / C3180-12041108 Number of placement heads: 2 or 1 IPC speed: 13.000cph SIPLACE benchmark evaluation: 15.000cph Theoretical speed: 20.000cph Range of components (mm²): 01005 to 200x125 Mounting head features: 6n
Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Industry News | 2003-04-28 08:12:02.0
The Micro-Meter 2 is an air-operated positive-displacement single-acting two-component system, designed to meter, mix and dispense small 'shots', or beads, of reactive materials.
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
Technical Library | 2023-06-12 19:00:21.0
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products, with increased functionality and smaller form factor, the boundaries of the whole assembly process are continually being challenged. Miniaturisation raises a number of issues for the stencil printing process. How small can we print? What are the tightest pitches? Can we print small deposits next too large for high mix technology assemblies? How closely can we place components for high density products? ...And then on top of this, how can we satisfy some of the cost pressures through the whole supply chain and improve yield in the production process! Today we are operating close to the limits of the stencil printing process. The area ratio rule (the relationship between stencil aperture opening and aperture surface area) fundamentally dictates what can and cannot be achieved in a print process. For next generation components and assembly processes these established rules need to be broken! New stencil printing techniques are becoming available which address some of these challenges. Active squeegees have been shown to push area ratio limits to new boundaries, permitting printing for next generation 0.3CSP technology. Results also indicate there are potential yield benefits for today's leading edge components as well. Stencil coatings are also showing promise. In tests performed to date it is becoming apparent that certain coatings can provide higher yield processing by extending the number of prints that can be performed in-between stencil cleans during a print process. Preliminary test results relating to the stencil coating technology and how they impact miniaturisation and high yield processing will be presented.
MIRTEC is pleased to announce that after an extensive evaluation BOSCH has selected MIRTEC’s 3D AOI Technology as the best solution to meet their ongoing quality initiatives. The evaluation process was exceedingly detailed and included a
The Vortik VPm Progressive Cavity Pump dispensing two-component materials for encapsulation.
Career Center | Westbury, New York USA | Management
Job Location: Northeast U.S. Salary: $200,000+ package Company: An internationally recognized pioneer and leader in the manufacture of high-tech wireless, hand-held devices. Position Description: Provide manufacturing leadership and growth to
Career Center | , | 2013-03-07 05:50:27.0
Looking for Leader ship Opprtunity in Electronics Manufacturing Plant in India
GPD Global | https://www.gpd-global.com/pdf/pump/Two-Part-Mixing-Pump.pdf
(additional dimensions in graphic on page 2) Mixing Ratio 1:1 to 10:1 Continuous Output Rate - maximum up to 6.6 ml/min* up to 12 ml/min* Weight with Drive approx
46969 | https://hellerindustries.com/wp-content/uploads/2018/07/Inline-Vacuum-Reflow-System.pdf
Heller Industries Inc.
