Industry Directory | Consultant / Service Provider / Manufacturer
Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
The Thermal Ceramics business of Morgan Advanced Materials has developed a versatile fiber, Superwool® Sealcoat™ HT, which is suitable for use in nearly a dozen furnace lining applications. From primary liner to emergency repairs, and backup insulati
Electronics Forum | Mon Sep 06 04:42:18 EDT 2004 | KenF
Thx for the replies. Acutally I am doing a process related study to see whether the process (pcb depanelling)can induce crack to an MLCC. After depanelling, I will do a thermal shock on the MLCC based on IEC 384-1, that is, five cycles of 30min at hi
Electronics Forum | Fri Sep 03 11:28:18 EDT 2004 | KenF
Fine crack in multi-layer ceramic capacitor (MLCC) may not be detectable by capacitance check.Could anyone out there advise which is the most appropriate method to test/detect fine crack ?
Used SMT Equipment | Circuit Board Assembly Products
The product introduction The SM-2009 scissors & pneumatic type separator, we use the most advanced non-stress idea to designed it, it’s help to prevent the chap phenomena as the PCB separated by the general separator, it’s improve the PCB’s quality
Industry News | 2021-11-30 01:54:12.0
After more than 100 years of development, X-ray imaging technology has formed a relatively complete X-ray non-destructive testing (NDT) technology system. In order to meet these needs, new detection technologies are constantly innovating, using Xray inline inspection technology. It can not only detect invisible crack or porosity such as aluminum casting , but also qualitatively and quantitatively analyze the detection results to find flaws early.
Industry News | 2012-09-17 15:38:30.0
SEHO North America, Inc. announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled “Reduction of Voids in Solder Joints …
Technical Library | 2009-05-21 13:41:05.0
Failure due to board flex cracks persists as the dominant failure mode in multi-layer ceramic capacitors (MLCC). (...) This paper is intended to show the impact of temperature cycling, high-temperature life tests, and multiple bend exposures to the MLCC with this flexible termination.
Technical Library | 2017-06-22 17:11:53.0
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.
http://www.pcb-separator.com/ https://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2019/1113/832.html Hand push pcb cutter/PCB cutting machine manufacturer/PCB V-cut machine manufacturer/PCB depaneling equipment, automatic pcb cutting machine,
http://www.pcb-separator.com/ https://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2019/1113/832.html Hand push pcb cutter/PCB cutting machine manufacturer/PCB V-cut machine manufacturer/PCB depaneling equipment, automatic pcb cutting machine,
Failure due to board flex cracks persists as the do
SMTnet Express, December 6, 2018, Subscribers: 31,514, Companies: 10,684, Users: 25,477 Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates Credits: DfR Solutions The multilayer ceramic capacitor (MLCC) has become a widely used
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0306-smart-card-cracked-die
. Result The die in this Smart card has been cracked and the symmetry of the crack suggests that the cracking occurred as a result of improper handling during assembly
ASCEN Technology | https://www.ascen.ltd/Products/PCB_board_assembly_system/PCB_depaneling_/166.html
. *The gap between the round knife and straight knife can be adjusted accurately. *Minimize the cutting press to avoid solder crack
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