Industry Directory: mm-0 (5)

JY Electronics

Industry Directory | Consultant / Service Provider

JY offers a great quality production or solution with a reasonable price on a short lead-time. we are not only producing products but also giving out a better solution for testing or connecting.

New SMT Equipment: mm-0 (137)

Precision Lead Former for Taped RADIAL Components (CF-9)

Precision Lead Former for Taped RADIAL Components (CF-9)

New Equipment | Lead Forming

The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25

GPD Global

ETA SMT Stencil Printers

ETA SMT Stencil Printers

New Equipment | Printing

Semi-Automatic SMT Stencil Printers - P300, P350, P400. Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. Printing scraper can rotate 45 degrees fixed up, easy printing stencil a

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Electronics Forum: mm-0 (83)

Re: 8 mil placement, part Deaux!!

Electronics Forum | Fri Sep 11 16:52:00 EDT 1998 | Dave F

0.050" -> 50 mil -> 50 pitch 0.80 mm -> 0.032" -> 32 mil -> 32 pitch 0.64 mm -> 0.025" -> 25 mil -> 25 pitch 0.50 mm -> 0.020" -> 20 mil -> 20 pitch 0.40 mm -> 0.016" -> 16 mil -> 16 pitch 0.20 mm -> 0.012" -> 12 mil -> 12 pitch Dave F

Re: 8 mil placement, part Deaux!! / My Mistake - Sorry

Electronics Forum | Mon Sep 14 09:25:49 EDT 1998 | Dave F

0.050" -> 50 mil -> 50 pitch | 0.80 mm -> 0.032" -> 32 mil -> 32 pitch | 0.64 mm -> 0.025" -> 25 mil -> 25 pitch | 0.50 mm -> 0.020" -> 20 mil -> 20 pitch | 0.40 mm -> 0.016" -> 16 mil -> 16 pitch | 0.20 mm -> 0.012" -> 12 mil -> 12 pitch | Dave F Y

Used SMT Equipment: mm-0 (123)

MPM Momentum+ Printer

MPM Momentum+ Printer

Used SMT Equipment | Screen Printers

MPM Momentum+ Printer Substrate treatment                                                       Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite  457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki  KE-2020

Juki KE-2020

Used SMT Equipment | SMT Equipment

accuracy :CHIP :±0.08mm;IC :±0.04mm unit range:8mm-72mm Strip, bulk material, with tray Model :JUKI KE-2020 name:Universal placement equipment,With IC cabinet ,high accuracy ,stable,suitable for all kinds of unit components with 5 heads  conditio

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: mm-0 (55)

GPD Global's PCD Technology Is Proven Compatible with Silver-filled Electrical and Thermal Epoxies

Industry News | 2010-12-07 14:53:07.0

GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.

GPD Global

Minimum Thickness PCB

Industry News | 2018-10-18 10:56:54.0

Minimum Thickness PCB

Flason Electronic Co.,limited

Parts & Supplies: mm-0 (294)

MPM Printing doctor blades of MPM UP2000

MPM Printing doctor blades of MPM UP2000

Parts & Supplies | Screen Printers

Product Name: 10inch; MPM printing doctor blades Part Number: 10 inch; 254mm length Description: 10 inch; MPM printers 254mm * 32mm * 0.3mm scraper blades Applicable models: UP2000 machine 10 inch; MPM printers 254mm * 32mm * 0.3mm scraper

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

MPM Printing doctor blades of MPM UP2000

MPM Printing doctor blades of MPM UP2000

Parts & Supplies | Screen Printers

Product Name: 10inch; MPM printing doctor blades Part Number: 10 inch; 254mm length Description: 10 inch; MPM printers 254mm * 32mm * 0.3mm scraper blades Applicable models: UP2000 machine 10 inch; MPM printers 254mm * 32mm * 0.3mm scraper blad

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: mm-0 (2)

Stress Analysis and Optimization of a Flip Chip on Flex Electronic Packaging Method for Functional Electronic Textiles

Technical Library | 2020-12-24 02:50:56.0

A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.

University of Southampton

Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting

Technical Library | 2015-05-28 17:34:48.0

The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.

Panasonic Factory Solutions Company of America (PFSA)

Videos: mm-0 (91)

Precision Lead Former for Raidal Components (CF9)

Precision Lead Former for Raidal Components (CF9)

Videos

The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25

GPD Global

MPM MOMENTUM+/M201908

Videos

Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)

Qinyi Electronics Co.,Ltd

Career Center - Resumes: mm-0 (1)

Sales Manager

Career Center | Shen Zhen, China | Management,Sales/Marketing

Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe

Express Newsletter: mm-0 (1)

Partner Websites: mm-0 (6083)

YAMAHA Flat Belt (2420 mm*2.2 mm*0.8 mm) | QYSMT

Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/2420-mm-2-2-mm-0-8-mm-flat-belt-198924?page=507&order=name+asc

YAMAHA Flat Belt (2420 mm*2.2 mm*0.8 mm) | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products Flat Belt Public Pricelist Public Pricelist Flat Belt (2420 mm*2.2 mm*0.8 mm

Qinyi Electronics Co.,Ltd

BGA 0.4 mm pitch - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/bga-0-4-mm-pitch_topic2084_post8572.html

: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5188 Post Options Post Reply Quote Tom H Report Post    Thanks(0)    Quote    Reply Topic: BGA 0.4 mm pitch     Posted: 08 Feb 2017 at 7:53am Here is the Cypress/Broadcom datasheet link - http

PCB Libraries, Inc.


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