Industry Directory | Consultant / Service Provider / Manufacturer / Standards Setting / Certification / Training Provider
BEST is a certified master IPC Training and Solder Certification center. We provide comprehensive courses for both Instructors and Operators including IPC-A-610, IPC J-STD-001, IPC-A-600, IPC/WHMA-A-620, and IPC 7711/7721 standard
Industry Directory | Marketing Agency
Samsung Electro-Mechanics produces high-tech integrated components of electronics and mechanical devices for all electrical devices.
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Full vision intelligent single-table PCB Router Q330 Feature *Full VIsion *Equipped with a CCD whole-board visual programming system *High-speed spindle and high-speed saw blade motor *Equipped with a broken knife detection function *High Safety Sta
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PTI-500 First Article Inspection Tester 版本号：PTI500V2.0 、 PRODUCT FUNCTIONALITIES ✦ADVANCED SOFTWARE, USER FRIENDLY INTERATIVE OPERATION MINIMALIST DESIGN ✦INTUITIVE VIEW OF TEST RESULT The test result is plotted on individual component which can be
Electronics Forum | Tue Oct 08 18:57:45 EDT 2013 | soscomputer
Hi i'd like to know if i can find another thing like this station : zhuomao zm6200 with optical alignment and camera to pick/place BGA or other component. Because people told me that is a chineese copy and maybe not have the real tc to reflow or reba
Electronics Forum | Thu Jul 06 10:21:25 EDT 2000 | Mike Firmstone
I need to get an idea of the value of assembled surface mount boards shipped in various sectors such as consumer electronics, mobile phones, computers, automotive electronics etc. Another way would be the output from contract assemblers eg Solectron
Used SMT Equipment | Pick and Place/Feeders
Product number: FX-3RA Detailed product introduction Electric/mechanical belt feeder can be thesame with models Characteristic： Chip components 90000CPH (0.040 sec / chip, optimumcondition) 66000CPH: chip (in accordance with theIPC9850 standard
Used SMT Equipment | Pick and Place/Feeders
Product Name: FX-3RA high speed modular chip mounter Product number: FX-3RA Detailed product introduction Electric/mechanical belt feeder can be the same with models Characteristic： Chip components 90000CPH (0.040 sec / chip, optimum condition)
Industry News | 2003-02-25 09:10:01.0
The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.
Industry News | 2003-03-14 09:03:48.0
Sarantel has developed a surface-mount version of its active GeoHelix miniature GPS antenna.
Parts & Supplies | SMT Equipment
YG12_YS12 mobile camera MARK CSCV90BC3-02- Yamaha Spare parts specification: YAMAHA KGT-M917U-01X SENSOR POS OMRON E3S-LS3P YG200 YAMAHA 90K21-038011 YG12_YS12 R axis driver motor YAMAHA 90K55-4W074Z&90K50-4W074Z AC SERVO MOTOR YV100XG YAMAH
Parts & Supplies | SMT Equipment
Yamaha YG12_YS12 mobile camera MARK Part Number : CSCV90BC3-02 Yamaha Air Valve A010E1-37W KM1-M7163-20X Yamaha Air Valve A010E1-54W KM1-M7163-21X Yamaha Air Valve A010E1-44W KM1-M7163-30X Yamaha Valve A010E1-35W KM1-M7162-20X Yamaha Valve A
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Suitable for cutting all kinds of PCB boards with V-cut, SMT circuit boards, aluminum boards, LED circuit boards, LED strips. Mainly used in the LED, SMT, mobile phone / mp3, electric toy, various electronic . please feel free to contact email addr
Suitable for cutting all kinds of PCB boards with V-cut, SMT circuit boards, aluminum boards, LED circuit boards, LED strips. Mainly used in the LED, SMT, mobile phone / mp3, electric toy, various electronic . please feel free to contact email addr
Events Calendar | Sat Jul 06 00:00:00 EDT 2019 - Sat Jul 06 00:00:00 EDT 2019 | Chennai, India
Reliable Electronics for the Automotive Industry Technical Workshop
Events Calendar | Wed Jun 07 00:00:00 EDT 2023 - Wed Jun 07 00:00:00 EDT 2023 | Indianapolis, Indiana USA
Indiana Chapter Technical Presentation and Networking Event: Batteries, Baseball & Beer
Career Center | Addison,Texas, Texas USA | Engineering
RF TEST ENGINEER The selected candidate will develop test sets for testing printed circuit boards used in vhf transmitters and receivers. The ability to develop test software and hardware for automated control of test equipment, fault isolation and
Career Center | Killdeer, North Dakota USA | Technical Support
SUMMARY OF RESPONSIBILITIES Technical collaboration with engineers and operators to explain scientific and technical ideas in language that is easier for average readers to comprehend. The purpose of this position is to provide guidance and suppo
Career Center | Chennai, Tamilnadu India | Engineering,Maintenance,Purchasing,Quality Control,Sales/Marketing,Technical Support
I have two year experience in debugging and SMT,THT, and BGA reworking at Avalon technology..
Career Center | Baguio City, Philippines Philippines | Engineering
Responsible to effectively utilize all of the available resources such as machines, materials, manpower and methods in order meet the Offsite metric goal according to the customers’ specifications, requirements and needs; Responsible for evalua
| https://www.eptac.com/press/eptac-corporation-releases-update-to-popular-ipc-certification-mobile-app-2/
EPTAC Corporation Releases Update to Popular IPC Certification Mobile App - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
KingFei SMT Tech | https://www.smtspare-parts.com/sale-40371387-n1f80102c-panasonic-msr-mmc-cpu-board-one-board.html
N1F80102C Panasonic MSR MMC CPU board One board Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
