Industry Directory | Consultant / Service Provider
Premier web and mobile application Development Company based in ahmedabad, India. With over 10 years of experience we have been delivering solutions that exceed our client’s expectation. We have staff including well educated,..
Industry Directory | Manufacturer
With over many years of PCB assembly experience, we can produce high-density PCBA such as a main-controlled board for electronics equipment, I/O Board for Robots, and PCBA for Smart Homes. ODM or OEM business are available.
Antennas exist in all communication equipment and in a broad range of electronics. The industries that use antennas range from telecom to medical industry to military applications. Current antennas are much smaller than previous generations and, in m
Disc Magnet Motors Disc Magnet Motors are advanced micro stepper motors which supply exceptional dynamic motor performance, finer step resolutions and higher acceleration unparalleled by any other stepper motor on today's market MICRO STEPPER MOTOR
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz ESL3 9kHz To 3GHz EMI Test Receiver The R&S ESL EMI test receiver combines two instruments in one, measuring EMC disturbances in accordance with the latest standards and also serving as a full-featured spectrum analyzer for dive
Industry News | 2003-02-25 09:10:01.0
The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.
Industry News | 2014-09-06 18:17:29.0
The SMTA is pleased to announce the launch of their mobile application on Guidebook for the 2014 SMTA International Conference and Exhibition.
Technical Library | 2018-08-22 14:05:42.0
Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5-µm lithographic design rules, excellent electrical performance, and unique mechanical properties, key in achieving board-level reliability at body sizes larger than 15 × 15 mm2. This paper describes the first demonstration of the board-level reliability of such large, ultrathin glass ball grid array (BGA) packages directly mounted onto a system board, considering both their thermal cycling and drop-test performances.
Technical Library | 2020-09-02 22:02:13.0
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI) products migrating away from the current subtractive processes towards a more technically adept technique, based on an advanced modified Semi Additive Process (amSAP). This pattern plate process enables line and space features in the region of 20um to be produced, in combination with fully filled, laser formed microvias. However, in order to achieve these process demands, a step change in the performance of the chemical processes used for metallization of the microvia is essential. In the electroless Copper process, the critical activator step often risks cross contamination by the preceding chemistries. Such events can lead to uncontrolled buildup of Palladium rich residues on the panel surface, which can subsequently inhibit etching and lead to short circuits between the final traces. In addition, with more demands being placed on the microvia, the need for a high uniformity Copper layer has become paramount, unfortunately, as microvia shape is often far from ideal, the deposition or "throw" characteristics of the Copper bath itself are also of critical importance. This "high throwing power" is influential elsewhere in the amSAP technique, as it leads to a thinner surface Copper layer, which aids the etching process and enables the ultra-fine features being demanded by today's high end PCB applications. This paper discusses the performance of an electroless Copper plating process that has been developed to satisfy the needs of challenging amSAP applications. Through the use of a radical predip chemistry, the formation, build up and deposition of uncontrolled Pd residues arising from activator contamination has been virtually eradicated. With the adoption of a high throwing power Copper bath, sub 30um features are enabled and microvia coverage is shown to be greatly improved, even in complex via shapes which would otherwise suffer from uneven coverage and risk premature failure in service. Through a mixture of development and production data, this paper aims to highlight the benefits and robust performance of the new electroless Copper process for amSAP applications
Career Center | , Pennsylvania USA | Engineering,Production,Quality Control,Research and Development
SKILLS Quote preparation for RFQ projects. Exposure to IPC A 610 and IPC A 600. Knowledge of Potential Failure Mode Effect Analysis (PFMEA), Process control plan (PCP) for new products, based on the Critical to Quality (CTQs). Knowledge in handli
Advances in Conductive Inks across Multiple Applications and Deposition Platforms SMTnet Express December 27, 2012, Subscribers: 26070, Members: Companies: 9073, Users: 34093 Advances in Conductive Inks across Multiple Applications and Deposition
SMTnet Express, May 11, 2017, Subscribers: 30,455, Companies: 10,596, Users: 23,229 Privacy Threats through Ultrasonic Side Channels on Mobile Devices Daniel Arp, Erwin Quiring, Christian Wressnegger and Konrad Rieck; Technical University
Heller Industries Inc. | https://hellerindustries.com/europe/
(Sat Nav B98 9HN), United Kingdom. Tel: +44 (0) 1386 791074 E-mail: Sales inquiry E-mail: Service and Applications Sales Director : Matt Jones Mobile: +44 (0
GPD Global | https://www.gpd-global.com/co_website/contact-salesteams-northamerica.php
Nozzles Real Time Process Control (FPC) Lead Formers Lead Formers Selection Axial Lead Former Radial Lead Former Peel Force Tester Peel Back Force Tester Applications APPLICATIONS OVERVIEW Conductive Adhesive Non-Conductive Adhesive Dam
