Industry Directory | Manufacturer
We make a variety of Metal Stampings specializing in Connectors, Switches, Terminals, Heat sinks, RFI/EMI shielding, Lead frames, Battery contacts and Spring contacts.
KS-800 New High-precision multi-functional LED SMT Pick and Place Machine, eight head in one take and stick, low energy consumption; independent research and development of integrated light weight,all 8 sets of Z-axis are controlled by independent mo
1. Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual. 2. Cast iron framework for rigidity. Punching dies are changeable. Easy set up of punching dies. 3. Moveable lower die for easy loading and unloadingPCB punch
Used SMT Equipment | AOI / Automated Optical Inspection
Made by Kohyoung Technology Korea. Highly Reflective Die 3D AOI New Model Meister D High-Density Substrates & Shiny Components and Highly Reflective Components
Used SMT Equipment | General Purpose Equipment
ASM MS899-DL Wafer Mapping Die Sorter Machine is in like new condition! Serial Number: MS899DL-01817-0402 Model Number: MS899-DL Year 2008 August Cycle Time: 175 ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3 degrees Collect type: Surfa
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2014-06-03 13:04:15.0
The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.
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Technical Library | 1999-05-07 10:14:57.0
This paper describes a model developed to calculate number of redundant good die per wafer. A block redundancy scheme is used here, where the entire defective memory subarray is replaced by a redundant element. A formula is derived to calculate the amount of improvement expected after redundancy. This improvement is given in terms of the ratio of the overall good die per wafer to the original good die per wafer after considering some key factors.
KS-800 New High-precision multi-functional LED SMT Pick and Place Machine, eight head in one take and stick, low energy consumption; independent research and development of integrated light weight,all 8 sets of Z-axis are controlled by independent mo
http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/138.html ??????????? ???????? ????/?????? ???????? ???? ??????/??????????? ????/PCB Punch depanel machines
Career Center | Altoona, Pennsylvania USA | Sales/Marketing
MacDermid Alpha Electronics Solutions, a Element Solutions, Inc. business and world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is s
Career Center | Littleton, CO USA | Production
Possess 18 years relevant work experience in manual/Auto bonding on Micro-Electronic & RF to support new product development in R&D Lab in defense & commercial sectors. Have an advanced soldering skill in both Through-Hole/SMT, and J-STD-001 cert
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Die-Catalog-800-000.pdf
. Component Forming Dies CF-8 61 1 H oll ing sw ort h S tre et Gr an d J un cti on , CO 81 50 5 Tel : (9 70 ) 2 45 -04 08 F ax : (9 70 ) 2 45 -96 74 We b: ww w.g pd -gl ob al.c om GPD Part No. 800-000 # = requires purchase of secondary exit chute package
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/dies?con=t&page=4
EDI® Extrusion Dies – Cast Film, Sheet & T Dies– PPS | Nordson Polymer Processing Systems BKG - EDI Corporate | Global Directory
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