Electronics Forum | Mon Apr 29 04:33:05 EDT 2002 | ianchan
You can try using the brand-solvent "Genesolv 2004" in conjunction with a degreaser machine(source for own machine type?). this all helps to clean off the NC flux. we used it all integrated together, to clean a satellite modular card. reason we ha
Electronics Forum | Mon Apr 15 09:55:45 EDT 2002 | Tom Van Heuklon
Can anybody explain breifly what some of the effects of flux residue from a no clean process might be on circuit performance? Alternatively, might you tell me where I might find such information?
Industry News | 2017-10-05 05:56:21.0
The SMTA Capital Chapter is pleased to announce its third meeting of 2017 on November 7th, scheduled from 5:30 pm to 8:00 pm at ZESTRON Americas, 11285 Assett Loop, Manassas, VA, 20109. Ravi Parthasarathy, Senior Application Engineer, ZESTRON Americas, will present “Cleaning Before Conformal Coating” and “pH Neutral Cleaning Agents - Market Expectation and Field Performance”.
Industry News | 2017-11-05 08:55:02.0
Removing contamination from printed circuit boards remains a huge reliability and warranty issue for PCB manufacturers. One of the cleaning experts from MicroCare Corp., the industry’s leading manufacturer of critical cleaning products, addressed that specific issue at the Texas Cleaning and Reliability Workshops in Austin and Dallas on Oct. 23rd and 25th, 2017.
Technical Library | 2018-11-20 21:33:57.0
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes.
Technical Library | 2013-04-11 15:43:17.0
With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to reinforce their assemblies against the inevitable bumps and drops that their products experience in the field. One method of reinforcement has been the utilization of underfills to "glue" certain SMDs to the PCB. Bumped SMDs attached to the PCB with a no-clean soldering process offer the unavoidable scenario of the underfill coming in contact with a flux residue. This may or may not create a reliability issue... First published in the 2012 IPC APEX EXPO technical conference proceedings
Article Return to Front Page No-Residue Technolo
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) • Misaligned solder mask (overlapping solder pad and print area) • Flux is too weak for the oxidation level of the board and/or components
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