New Equipment | Board Handling - Storage
Intelligent Dry Storage Cabinets for Moisture Sensitive Devices The control of moisture sensitive devices (MSDs) prior to reflow soldering is a topic at the forefront of electronics manufacturing. Assemblers are adopting moisture management solutio
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
Electronics Forum | Wed Nov 09 10:25:09 EST 2005 | Amol
where in india are you laxman? and what kind of manufacturing are you involved in?
Electronics Forum | Mon Nov 07 07:43:56 EST 2005 | pjc
No way I've ever heard to remove mositure from solderpaste. What is the R.H. in your factory? Are you in the tropics? Does you printer have an enclosed print area like on an automatic machine, or is it semi-automatic and exposed to the room air?
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2012-10-09 16:13:23.0
Industry-leading associations IPC and SMTA jointly announce the agenda for Session 1 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Technical Library | 2020-11-29 22:06:45.0
Plastic laminates are increasingly used as interposers within chip packaging applications. As a component within the package, the laminate is subjected to package moisture sensitivity testing. The moisture requirements of chip packaging laminates are related to ambient moisture absorption and thermal cycling. Printed wiring board (PWB) laminates, however, are gauged on properties relating to wet processes such as resist developing, copper etching, and pumice scrubbing. Consequently, printed wiring board moisture absorption test methods differ from chip packaging test conditions.
Technical Library | 2012-02-16 16:53:16.0
Channel simulations are only as accurate as the models used to develop them. While we have seen much effort placed on printed circuit board (PCB) materials (copper finish, dielectric moisture absorption), other elements within the channel have been largel
This video is designed to help packaging engineers, quality control managers and those tasked with preserving critical parts in enclosed spaces for storage and usage. The video will highlight different features and benefits of the Moisture Hog desic
Présentation lors du salon ENOVA Paris 2014
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
ORION Industries | http://orionindustries.com/pdfs/frfilm.pdf
. Low moisture absorption and excellent dielectric properties make ULTEM film the superior choice for a broad range of applications including high-voltage internal insulation, high-temperature PSA tapes and speaker cones
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_09_16_09.pdf
. That is, either the environmental stress was higher than expected or the material strength was lower than expected. Pb-Free Reflow, PCB Degradation and Moisture Absorption Monday, July 20, 2009 | Kerin
