Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
New Equipment | Board Handling - Storage
Eureka SDC-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/sdc-101 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Stands, 1 M ω Ground Wire Model: SDC-101 Fast Super Drye
New Equipment | Board Handling - Storage
Eureka SDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/sdc-2001 Model: Eureka SDC-2001 Fast Super Dryer Capacity: 1314 Liters Humidity Range: LESS THAN 10% Recovery Time: Recovers to ≤ 10% R
Electronics Forum | Thu May 08 11:58:12 EDT 2003 | fmonette
Hi Chrissie, This might be old news to you but I just wanted to make sure that you are aware of all the implications of BGA rework relative to the control of moisture-sensitive components. For example, you need to keep track of the total exposure t
Electronics Forum | Wed Oct 17 18:42:37 EDT 2001 | scott
Any processes that I need to be aware of that differs from standard FR4 during reflow and wave soldering? I've read one of the problems is the thermal expansion of teflon is quite different from copper. I've also seen a "blurb" where teflon absor
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2019-04-07 22:47:46.0
How to protect your PCB from moisture related damage? J-STD-033 put forward stricter regulation on the MSD exposure environment,when the exposure time exceed the tolerated,the moisture will penetrate into electronics,Moreover, the newest RoHS regulation will rise soldering temperature,the sudden high temperature will lead to expansion and cracking on electronic components. In order to decrease the moisture defect on PCB for the manufacturers in China,Climatest Symor® begin to concentrated on electronic dry cabinet R&D since early 1990s,we specialize in handling temperature and humidity for 20 years,and we provide best solution for PCB storage.
Technical Library | 2024-09-02 18:48:58.0
The conversion to higher temperature "Lead Free" assembly reflow conditions has created an increased awareness that entrapped or absorbed moisture is a frequent root cause of thermally induced delamination at assembly reflow. There are two connected failure modes from entrapped moisture; incomplete resin cross-linking resulting in premature resin decomposition and also severe Z axis expansion from "explosive vaporization of the entrapped moisture at elevated temperatures at assembly reflow". Ultimately, both result in delamination failure. Other papers have shown the negative effects of entrapped moisture before lamination including delamination, red color, reduced thermal reliability and increased high speed signal loss. In this paper, various materials were tested for moisture sensitivity during lamination. Tests were performed at varying lamination conditions including a pre-vacuum step and "kiss" step. Pressure and cure temperature parameters were evaluated for minimizing or eliminating the effect of trapped moisture. Also included are the results of inner layer moisture removal baking conditions and their effect on peel strength and thermal reliability.
Great improvements on Makerfabs Lora Soil Moisture Sensor V3!!! 1. TLC555 removed, while the Atmega328P(D9/Timer1) generates the 2 MHz pulse (only during measurement phase, switching off afterward), for capacitive moisture measurement. 2. Unique ID b
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. A combination of rapid moisture expansion and mismatched materials contribute to the various types of damage induced by humidity
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2515-popcorn-crack
. Popcorn cracks are the result of the explosive expansion of moisture during reflow, and often originate under the die paddle and extend upward
