Electronics Forum | Thu Aug 27 11:35:07 EDT 2009 | davef
There are many possibilities: * Conformal coat is incompatible with surface residue on the board * Conformal coat is incompatible with solder mask on the board * Moisture is out-gassing from the board * Conformal coat is too thick and does not allow
Electronics Forum | Sat May 02 08:48:32 EDT 2009 | davef
You have a board defect. Any moisture and/or organic contaminants trapped by the solder resist during lamination may cause solder mask delamination, blistering and/or adhesion loss during subsequent soldering operations or during extended use.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. During solder reflow, the combination of rapid moisture expansion and materials mismatch can result in package cracking and/or delamination of critical interfaces within the package
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. Any components that are sheathed in plastic or organic compounds are susceptible to this type of damage. Moisture absorption damage typically occurs during the solder reflow process
