New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
New Equipment | Board Handling - Storage
Eureka TD-1001 Fast Super Dryer Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/td-1001 Capacity: 657 Liters Humidity Range: LESS THAN 20% Recovery Time: Recovers to ≤ 20% RH within 30 minutes after accessing door for 30 s
Industry News | 2003-05-30 07:52:35.0
New courses on today's most important topics in electronics manufacturing, assembly, and related business issues
Industry News | 2003-04-21 10:24:56.0
Learning today for tomorrow's demands
Technical Library | 2014-06-12 16:40:19.0
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
WASET - World Academy of Science, Engineering and Technology
Technical Library | 2020-12-16 18:38:49.0
Fabrication of large structures using out-of-autoclave prepreg materials will lead to a great amount of savings in manufacturing costs. In the out-of-autoclave processing method, the presence of voids inside the laminate has been an issue due to the lack of high pressure during manufacturing. This study aims primarily to observe the moisture absorption response of composite samples containing different levels of void. By changing the vacuum level inside the bag during the manufacturing process, three different unidirectional laminates at three levels of void have been manufactured. After immersing the samples in warm water at 60°C for about one year, the moisture absorption level was monitored and then diffusion coefficients were calculated using Fick's law. Results show that the moisture absorption coefficient changes by %8 within the experimental range of void contents. The mechanical behaviour of these laminates has been studied at four different moisture levels by performing dynamic mechanical analysis (DMA) and short beam shear tests. Empirical results indicate that, in general, interlaminar shear strength and glass transition temperature decrease by moisture build-up inside the samples. DiBenedetto equation is proposed to make a correlation between the moisture content and glass transition temperature.
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 48, (#ts#)) SMT Express, Volume 3, Issue No. 3 - from SMTnet.com Volume 3, Issue No. 3 Thursday, March 15, 2001 Featured
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 86, (#ts#)) SMT Express, Special Edition, Issue 1 - from SMTnet.com Special Edition Issue 1 Featured Article Return
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/txs02612rtwr-footprint-issues_topic2244_post9285.html
: 71 Post Options Post Reply Quote toshas Report Post Thanks(0) Quote Reply Topic: TXS02612RTWR Footprint Issues Posted: 30 Oct 2017 at 10:45am Hi! I downloaded TXS02612RTWR footprint and have some issues with it
| https://www.eptac.com/soldertips/issues-of-burnt-flux-on-class-3-pcb-assemblies/
) to pierce through the rosin, creating lots of open connections. Burnt flux implies the carbonization of the rosin material or any other material and this material is very susceptible to the absorption of moisture and the issues we just mentioned
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