Specialists in end-of-life preservation packaging of electronics. Shelf-life consultants. Marketing, sales and distribution of Static Intercept and Corrosion Intercept Reative Polymers. Eliminating rust, tarnish and corrosion in metals-chemical free
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Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
All electronic hardware is susceptible to the damaging effects of moisture, temperature, and contaminants. STI understands the criticality of reliability testing and test-to-failure. Improper selection of assembly materials and manufacturing processe
New Equipment | Board Handling - Storage
Eureka XDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs http://www.eurekadrytech.com/fast-super-dryer/xdc-2001 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Caster / Stands, 1 M ω Ground Wire Capacity: 1314 L
Electronics Forum | Fri Sep 09 05:29:25 EDT 2016 | jasltd
simpel answer is yes it will need to be baked, the typical shelf life for a sealed component assuming it has been sealed would be a max of 2 years but some are shorter. The bugger problem with the device may well be solderability of the device!
Electronics Forum | Mon Aug 22 18:25:54 EDT 2016 | cox1
I have a MS level 3 component that has been on the shelf for 7 years. Should it be baked before usage. The HIC card reads ok- and it was stored with desiccant. History of the part is unknown, was purchased from franchised distribution.
Used SMT Equipment | In-Circuit Testers
FSM-60S Fusion Splicer Kit (with cleaver) - The FSM60S fusion splicer sets the standard for core alignment fusion splicing by incorporating a user-friendly interface with enhanced features to provide the most rugged and reliable fusion splicer in the
Used SMT Equipment | In-Circuit Testers
Fujikura FSM-60S FSM-60S Fusion Splicer Kit (with cleaver) - The FSM60S fusion splicer sets the standard for core alignment fusion splicing by incorporating a user-friendly interface with enhanced features to provide the most rugged and reliable
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Technical Library | 2009-12-03 14:27:29.0
This paper provides additional data in support of shelf life extension for BGA and Die Size BGA (DSBGA) Packages.
Technical Library | 2009-12-03 12:51:58.0
Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension.
The natural sustainable desiccant solution for moisture controlled packaging Desiccants are hygroscopic (moisture-adsorbent) substances that are packaged and used to protect a broad range of products from degradation due to moisture, helping to main
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
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Parts and Assembly Storage Life: How to Determine and Manage
Career Center | Hyderabad, Telangana India | Engineering,Maintenance,Production
Experience in handling Process related issues throughout the Product Manufacturability. Programming and maintenance of SMT Pick and Place Machines of Mirae, Panasonic, NXT and MyData Programming and maintenance of Solder Paste Printer of DEK
Career Center | , California | Quality Control
Tammy T Vo P.O. Box 2213 (714) 254-5073 E-mail: nhutamvo@yahoo.com Position of Interest Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications 12 years of experience wo
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. High vacuum can actually be detrimental by increasing the amount of moisture diffusion through the bag. 4. The bag seal date and the 12 months minimum shelf life is not an expiration date
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
What You Must Know About Moisture Sensitive Devices (MSDs) Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
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