Built around ECD's award winning V-M.O.L.E.® Thermal Profiler, the OvenCHECKER™ system comes complete with the profiler, thermal barrier, pallet and M.O.L.E.® MAP software, making it a complete solution for reflow oven verification. OvenCHECKER™ gr
Electronics Forum | Tue Apr 05 08:16:30 EDT 2005 | jax
This is not a built in function, you have to trick the machine. 1. Determine what you want to use to play "whack-a-mole" Regular or Modified nozzle. Regular will most likely get damaged from multiple "whacks" 2. Teach the nozzle
Electronics Forum | Fri Mar 19 07:24:29 EST 2004 | pjc
Before "Pb-Free" became an issue we were and still are using Pb-Free component lead finishes- such as on many TSOP, SSOP and QFP packages as well as caps. Components manufacturers changing the lead finish to no-Pb tend to ensure solderability with Sn
Industry News | 2017-10-31 18:46:42.0
At this year’s Productronica event in Munich, Germany, ECD (Hall A4, Booth 532) will showcase its award-winning thermal profiling technologies, including the broad portfolio of M.O.L.E.® thermal profilers, wave soldering test pallets and reflow oven performance verification tools. In addition, the company plans to debut a next-generation, scalable monitoring system designed to provide continuous oversight and customizable data analysis for various SMT thermal processes. The first module centers on reflow oven performance and output optimization
Industry News | 2001-08-02 13:39:10.0
ECD has announced that its new Guide to Quality Control of the Automated Solder Process is now available. This 16 page Guide will provide users with important information about Classic PCB Temperature Profiling as well as how to maintain a wave or reflow solder machine in "factory-new" condition.
