Electronics Forum | Fri Jun 03 15:19:32 EDT 2022 | dwl
I don't recall thicknesses off the top of my head but brittleness becomes an issue more for gold plating then ENIG. .125 um should be fine. also, gold ain't cheap so its unlikely your PCB fab will get anywhere near the max tolerance. On the other e
Electronics Forum | Wed Jun 08 23:04:26 EDT 2022 | SMTA-64387544
Au thickness of 0.125 um should not cause solder joint embrittlement. Also, PCB fab should offer Au thickness range between 0.05-0.075 um for better process control and reliability. Higher Au thickness may suggest black pads leading to solder joints
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Printed Circuit Board (PCB) for Surface Mount Technology (SMT)
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Basic Soldering Guide – How to Solder Electronic Components
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Drawbridging See Tombstoning . E ENIG Surface finishing process of electroless nickel followed by immersion gold. During soldering the gold is dissolved into the solder joint
| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them
. To resolve this error and ensure long-term reliability, simply reheat the joint and apply more solder until you have the right amount of solder and the joint is strong. 3
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