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New Equipment | Industrial Automation
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Electronics Forum | Tue Jul 19 11:21:50 EDT 2005 | russ
You may want to try reducing the large center aperture on your stencil to 50-70% of the area of the pad. This is what we do with QFNs and it may be applicable in this case also.
Electronics Forum | Thu Jul 21 09:43:10 EDT 2005 | davef
We agree with Russ. The solderballs are probably the result of printing too much paste on the board. In designing your 5 thou thick stencil: * Aperatures for the pads should be identical to a IPC-7351 - SO8 [or worst case http://www.vishay.com/docs
Industry News | 2005-04-26 15:48:02.0
New family of high-threshold, low on-resistance power MOSFETs for automotive and other high-current, high-temperature applications was issued by Siliconix.
Industry News | 2020-12-29 19:46:07.0
New Ultrafast Rectifiers Feature Unique Combination of Low Conduction and Switching Losses
Whizz Systems | https://www.whizzsystems.com/ic-package-design/
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