Industry Directory | Consultant / Service Provider / Manufacturer
Electronics Manufacturing Services (EMS) including printed circuit board assembly, with specialties in surface mount and through-hole LED circuit board assemblies.
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Other
Ludee Circuits offer RoHS PCB.We could offer leadfree HASL,Entek, flash gold, immersion gold, immersion silver, immersion tin finishing based on standard FR-4, CEM-3 materials, Teflon, Rogers RO4000 series, as well as high Tg S1170 materials.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
New Equipment | Education/Training
This program is for experienced solderers seeking an in depth knowledge of the J-STD-001 Document. The course reviews this document and helps students learn how to interpret the criteria. Open and closed book exams are required after each module. Han
Electronics Forum | Thu Dec 05 02:15:12 EST 2019 | sssamw
IPC 2221B mentions a minimum clearance of 0.5 mm between adjacent holes. A drill-to-drill spacing of 20 mils is a standard value in manufacturer design rules. For small annular rings and pad-to-pad clearance, the minimum via distance is often defin
Electronics Forum | Wed Aug 28 19:35:13 EDT 2002 | ppwlee
Hi, Does anyone have guidelines on minimum SMT component spacing for bottom sided wave soldering? I am looking for general rule of thumb in wave soldering bottom side SOTs, 0805 & 0603s. How about minimum through-hole lead to pad distance? Peter
Used SMT Equipment | Pick and Place/Feeders
Samsung SM411, Samsung SM411 Mounter, Second-hand Samsung SM411 Chip Shooter Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH an
Used SMT Equipment | Pick and Place/Feeders
Make: JUKI Model: JUKI JX-100 Details:1.High Cost Performance - By selecting essential functions, it achieves high production at a low cost. The JX-100 mounting machine uses the same recognition system as JUKI's high-end models, reaching a high-spee
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2003-04-14 08:50:52.0
Providing connection facilities for PCBs designed to be used in hazardous areas is straightforward with Phoenix Contact's new range of Combicon Ex-approved printed circuit terminal blocks.
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Parts & Supplies | Pick and Place/Feeders
JUKI Mounter Chain Introduction (1) JUKI Mounter towline shape like a tank chain, composed of a number of unit links, links between the rotation freely. (2) the same series of towline within the high, high, the same pitch, towline width, bending ra
Parts & Supplies | Circuit Board Assembly Products
1). 24 hours lead time. 2). FR-4 Material, Single sided or Double sided. 3). 1 oz copper weight, 1.6mm thick. 4). Green solder mask /white silkscreen 5). 4/4 mil track/space, 0.3mm minimum holes 6). Hot air level finish
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Career Center | Fort Worth, Texas USA | Production
The requirements for the Manufacturing Engineer are a BS in Engineering with surface mount device(SMD),surface mount technology (SMT) thru-hole, and wave solder knowledge. Also, experience in fixture design, developing manufacturing processes and rel
Career Center | Valley View, Ohio USA | Production
Machine operator to operate an automated through hole and Surface Mount Technology (SMT) industrial soldering machines. Operator should have 1 year hands on experience operating the Universal (Sanyo) GSM Platform Machine. Must be proficient en
Career Center | Stouffville, Ontario Canada | Engineering,Maintenance,Production,Quality Control,Technical Support
A versatile Facility, Manufacturing and Program Manager with over 18 years of progressive experience in the Electronic Manufacturing Service complimenting the needs of OEM/ECMs in the Automotive, Consumer and Commercial electronics and Datacom and Te
Career Center | NOIDA, UP India | Production,Research and Development,Technical Support
• 17+ years of experience as Programmer/Analyst/Technical Lead/Project Lead/Technical Manager/Technical Architect • 9+ years of experience in PCB Automation Assembly Process MES (Manufacturing Execution Systems). • SMT (Surface Mounting Technolog
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
| https://www.eptac.com/faqs/ask-helena-leo/ask/spacing-of-radial-components-off-a-printed-circuit-board
: What is the spacing requirements between the board and the bottom edge of the component that doesn’t have a spacer or insulator in a supported through-hole terminations? Question
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/tolerances/
.004″ for vias and a minimum of 0.006″ for component holes. VIPPO process allows + 0.006” (0.003” each side) Hole Size Our minimum finished hole size is 0.004″ laser, 0.005″ mechanical
