Industry Directory | Consultant / Service Provider / Manufacturer
VEMAS Corp specializing in PCB assembly, cables, and system assembly . Testing services available. Outstanding service.
Industry Directory | Consultant / Service Provider
Consulting firm established to promote career opportunities in the electronic manufacturing industry. We specialize in the printed circuit board assembly industry servicing the computer, telecommunication, medical, instrumentation and process controls equipment. Our customers use the state of the art equipment such as fuji, panasonic, universal pick & place equip., chip shooters, reflow
New Equipment | Assembly Services
Our extensive PCB assembly expertise incorporates: Prototypes and pilot builds Conventional electronics assembly Surface mount assembly State-of-the-art equipment RoHS and non-RoHS facilities Cost effective design Core to the JJS Electronics m
Fisher Control Valves & Regulators Fisher Products process control valves, digital valve controllers, pressure regulators and field automation systems Fisher,Emerson Process Management,Valves,Control Valves,Actuators,Process Instruments,Instrumentati
Electronics Forum | Wed Aug 23 11:06:57 EDT 2017 | cyber_wolf
Bad Z-force sensor or it is checking the board height in a hole.
Electronics Forum | Mon Aug 21 11:38:20 EDT 2017 | smdbert
Hello , How to solve this problem. Thnxs Bert
Used SMT Equipment | Board Cleaners
Speedline Electrovert Aqueous Cleaning System In-line Cleaner Model: Aquastorm 200 (Torrid Zone) Year: 2004 S/N 480409 Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray manifolds Valve switching to div
Used SMT Equipment | Board Cleaners
Speedline Electrovert Aqueous Cleaning System Brand: Speedline Model: Aquastorm 200 (Torrid Zone) Serial #: 480409 Year: 2004 Type: In-line Cleaner Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray m
Industry News | 2003-04-08 14:01:01.0
Sparton's design engineering team is one of 265 worldwide members in the Motorola Design Alliance program.
Industry News | 2018-01-28 15:45:10.0
During the 2017 Annual Meeting at SMTA International, the SMTA honored members who have shown exceptional service to the association and the electronics assembly industry. Nominations are now accepted for the 2018 awards program.
Parts & Supplies | Pick and Place/Feeders
KH4-M655F-20X DS4R out of the board Sensor YAMAHA YV100II Chip Mounter KGA-M928A-00X SENSOR , LOW 1 L=1150 KGA-M928B-00X SENSOR , UP 1 L=1150 KGA-M927A-00X SENSOR , UP KGA-M927B-00X SENSOR , LOW KGA-M928A-00X SENSOR,LOW KGA-M928B-00X SENS
Parts & Supplies | Pick and Place/Feeders
N210136905AB PLATE 0 N610124004AA フレキシブルコンベアステーション(搬送部)IPC対応 Flexible Conveyor St (Trannsport Unit) For IPC:NPM-D N210081910AB PLATE 0 N610087916AA 荷重キャリブレーションジグ Load Calibration Jig N210155534AA BRACKET 0 N610073135AA 交換台車切替ユニットガイド部:NPM Feeder
Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
Technical Library | 2021-12-16 01:52:32.0
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor.
To see more visit Pillarhouse here: https://www.pillarhouse.co.uk/products/selective-soldering-handload/pilot-handload Economical, compact, single point selective soldering system The all-new ultra-low-cost Pilot machine has been designed as an ent
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Training Courses | | | IPC Designer Certification CID+
The CID+ is the advanced version of the Certified IPC Interconnect Designer (CID) program targeted toward those working in the PCB design industry.
Training Courses | | | IPC Designer Certification CID+
The CID+ is the advanced version of the Certified IPC Interconnect Designer (CID) program targeted toward those working in the PCB design industry.
Events Calendar | Mon Feb 19 00:00:00 EST 2024 - Mon Feb 19 00:00:00 EST 2024 | ,
SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board
Events Calendar | Thu Jun 13 00:00:00 EDT 2024 - Thu Jun 13 00:00:00 EDT 2024 | Melbourne, Florida USA
Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
Career Center | Home Based, Utah USA | Sales/Marketing
VP of Business Development, Corporate Accounts 1099 arrangement, a contracted sales representative, home based Do you want the opportunity to make unlimited income? Do you want the freedom to decide your work schedule? Do you want to be your own
Career Center | Chandler, Arizona USA | Technical Support
Koh Young America is looking for technical field application engineers to support our world class electronics 3D measurement and inspection products. This a dynamic position and will require skills to handle both technical pre-sales activities, s
Career Center | Kitchener, Ontario Canada | Engineering,Maintenance,Technical Support
Knowledgeable in Design of Experiments (DOE), Design for Manufacturability (DFM), Statistical Process Control (SPC), Failure Mode & Effects Analysis (FMEA) and Root Cause Analysis that drives continuous improvement in package reliability. A recogniz
Career Center | Williamsburg, Kentucky USA | Engineering,Production,Quality Control
SKILLS My computer skills are fluent with experience in Microsoft Word, Internet, WordPerfect and Microsoft Works. I have an extensive electronics background. I can type 40 wpm. I am multi-skilled with a vast knowledge in electronics and over 10 y
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/terminal-density-level-of-bga-footprints_topic3058_post12206.html
Terminal Density Level of BGA footprints - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login Terminal Density Level of BGA footprints
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/wafer-level-packaging-symposium-2022
. One of these advanced technologies is silicon-based wafer-level packaging, such as fan-out wafer-level packaging. As the semiconductor industry shifts focus to more than
