Used SMT Equipment | SPI / Solder Paste Inspection
MS-11e 3D SPI Equipment High Speed Precision In-Line SPI Equipment System Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System. 10 Micron / Pixel Precision TELECENTRIC COMPOUND LENS Design Advanced Dual Projection SHADOW FREE MOIRé Design 2 Micron Heig
Used SMT Equipment | SPI / Solder Paste Inspection
Mirtec 3D In-Line Solder Paste Inspection (SPI) Model: MS-11e Vintage: 2015 OS: Windows 7 15 meg/10 um CXP Camera Max Board Size: 20.1" x 18.1" Min Board Size: 2" x 2" Complete & Operational
Industry News | 2016-09-28 10:10:43.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2016 Global Technology Award in the category of Inspection – SPI for its MS-11e 3D SPI Machine. The award was presented to the company during a Tuesday, Sept. 27, 2016 ceremony that took place at the Donald Stephens Convention Center in Rosemont, IL during SMTA International.
Industry News | 2018-10-15 18:51:46.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce plans to exhibit its award-winning MV-6 OMNI 3D AOI System and MS-11e 3D SPI Machine at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Nov. 14 - 15, 2018 at the Expo Guadalajara.
► Exclusive15MP / 25MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB
Exclusive15MP / 25MP CoaXPress Camera System Dual Projection Shadow Free Moiré Technology Precision Compound Telecentric Camera Lens Automated Z-Height Calibration System Automated PCB Under Board Support System Precision PCB Warpage Compensatio
