Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
New Equipment | Solder Materials
Whether you are a hobbyist, sheet metal fabricator, or an electronics assembler, StellarTechincal.com provides quality solder for you, including lead-free solder wire. When you shop online at our business, you’ll be able to get a solder bar, babbit f
New Equipment | Solder Materials
The MULTICORE portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire. This mainstay in Henkel’s line of solder products delivers eas
Electronics Forum | Mon Mar 02 13:06:36 EST 2020 | charliedci
If you add any "flux cored" wire solder to the pot make sure you have ventilation as the flux will burn off and smoke like crazy. This solder pot is like any used in a wave or selective solder, no flux. The flux is added to wire prior to di
Electronics Forum | Tue Nov 24 18:45:12 EST 2009 | gregoryyork
We put it in one flow soldering machine probably 12 years ago now worked really well but was extremely brittle you maybe better off with the 1% Ag alloy as its more ductile. Look at AIM Solders site if you want further information on the alloy Itis a
Industry News | 2010-09-01 21:50:50.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that SN100C wets and spreads faster than SAC305.
Industry News | 2013-05-07 13:45:19.0
AIM Solder announces that NC259 Solder Paste is a low-cost, lead-free and halogen-free solder paste that offers superior performance comparable to that of tin/lead and high-silver lead-free solder pastes, a virtual drop-in for costly SAC305.
ALPHA® Telecore XL-825 lead-free cored solder wire minimizes spattering in hand soldering operations, thus reducing circuit board contamination and enhancing worker safety and comfort.
SMTnet Express August 29, 2013, Subscribers: 26233, Members: Companies: 13474, Users: 35110 Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging by Mike Powers, Jianbiao Pan, Julie Silk, Patrick
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
, Ph.D, Sitaram Arkalgud, Ph.D, and Eric Tosaya Abstract 29-1 Effect of Gold and Copper on AuSn4 Deposition and Isothermal Durability of SAC305 Solder Joints Subhasis Mukherjee, Carlos Morillo, Lay-Ling Ong, Julie Silk, and
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