Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
New Equipment | Board Handling - Storage
The Dr.Storage T40W are plug and play, fully auto dry cabinets which can bake at a stable 40℃ and maintain a consistent The T40W Baking Cabinets Series has a double wall design to ensure it maintains a stable According to J-STD-033B, using a T40W
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Wed Sep 13 09:15:19 EDT 2006 | Rob
Hi Peter, Out of the 1.5 billion components we shipped last year, we had 3 components back for solderability issues. All 3 had been taken out of their vacuum packaging and left to oxidize for a number of weeks. We don't see it as an issue, but we
Industry News | 2003-02-11 08:42:41.0
To Handle Outbound Logistics Projects for OEMs and to Gain Greater Insight into Their Customers' Requirements for Global Direct-order Fulfillment
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Parts & Supplies | SMT Equipment
4022 594 21990 402259421990 CNTRLLER ACM RLSE 4 NEW 4022 594 22500 402259422500 DIO CARD 4022 594 22510 402259422510 BITBUS CARD 5322 216 04099 532221604099 CAN PCB PCI 166/CAL 5322 252 11118 532225211118 FUSE, 5SX2310-7 9498 396 01043 9498
Parts & Supplies | SMT Equipment
4022 594 21990 CNTRLLER ACM RLSE 4 NEW 4022 594 22500 DIO CARD 4022 594 22510 BITBUS CARD 5322 216 04099 CAN PCB PCI 166/CAL 5322 252 11118 FUSE, 5SX2310-7 9498 396 01043 3 PHASE SAFETY RELAIS 5322 280 10304 EMER. RELAY PNOZ8/24VDC 5322
ECD's SmartDRY™ desiccant dry cabinet, for surface mount technology (SMT) components storage, intelligently controls moisture sensitive level (MSL) to the J-STD-033 Specification while mitigating electrostatic discharge (ESD) at low relative humidity
Reflow Profiling: Time Above Liquidus Reflow Profiling: Time Above Liquidus Despite much research and discussion on the subject of reflow profiling, many questions and a good deal of confusion still exist. What is clear is that the pains often
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. The decision to bake components is strictly based on the status of the humidity indicator card when the bag is opened. 5. The clock of exposure time does not always stop when previously exposed components are returned to dry storage
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. The increase in temperature has led to more damage, and more botched yields. According to Assembly Mag , for every 10-degree increase in temperature, the MSL rating degrades by one level