The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
Electronics Forum | Wed Apr 16 02:40:57 EDT 2008 | andrzej
hello, I found on label two information about MSL level : MSL-2 - 240C MSL-3 - 260C Does it corresponds to SnPb and Pb-free ?
Electronics Forum | Thu Apr 17 07:57:07 EDT 2008 | GSx
Those components can be soldered at both SnPb and Pb Free Reflow process. In case you will submit them to Pb Free Reflow temperature you must treat those components as MSL-3 In case you will submit them to SnPb Reflow temperature, you must treat t
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
EVALUATION OF MOISTURE SENSITIVE LEVEL (MSL) AND RELIABILITY OF DEVICES FOR HIGH RELIABILITY APPLICATIONS As Presented at SMTAI September 2003 EVALUATION OF LEAD-FREE SOLDER BONDS AND EFFECTS OF THE LEAD-FREE PROCESS ON DEVICES USING AMI As
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