The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
Electronics Forum | Tue Jun 03 13:23:02 EDT 2014 | taiji
Also, for MSL 1 and 2, non sealed components, what should be the min/max storing temperatures?
Electronics Forum | Fri May 13 17:28:43 EDT 2016 | dyoungquist
Depends a little on how long it was exposed to the wet environment as moisture absorption by electrical components is a very slow process. That said, MSL 1 rated components can be exposed to high humidity indefinitely and still not need to be baked.
Industry News | 2014-01-31 00:23:23.0
Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.
Industry News | 2014-03-04 11:29:02.0
Indium Corporation will feature its new high-melting lead-free solder paste technology, BiAgX™, at Semicon China on March 18-20 in Shanghai, China.
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