Electronics Forum | Tue Feb 08 14:14:23 EST 2005 | Jim V.
Looking for suggetions on improving the bottom side connection on MSOP package. What is the common paste / pad / stencil aperture practice?
Electronics Forum | Tue Feb 08 19:45:14 EST 2005 | davef
Use multiple small stencil openings [15 thou square], where total area approximately 50% of total PCB ground pad. What's the problem?
Industry News | 2003-04-29 08:44:42.0
New technology allows the CAT24C00 to be packaged in a compact, 5-pin SOT23 package that requires 40 percent less printed circuit board area than an MSOP package.
Industry News | 2023-03-24 09:23:31.0
ViTrox, which aims to be the world's most trusted technology company, is excited to announce the launch of the enhanced Tray-based Vision Handler, TR1000S⁺i!
TI New and Original TPS57060QDGQRQ1 in Stock IC Texas Instruments, MSOP-10, 2021+ package TPS57060QDGQRQ1 Automotive 3.5V to 60V, 500mA Step-Down Converter with Eco-Mode™ TI New and Original SN65HVD234D in Stock IC Texas Instruments, SOP8
TI New and Original INA228AQDGSRQ1 in Stock IC MSOP ,21+ package INA228AQDGSRQ1 85V, 20-Bit, Ultra-Precision, I2C Output Current/Voltage/Power/Energy/Charge Monitor with Alarm TK13A25DS4X(S TO-220F Toshiba 15+ XC6219B152MR-G SOT153 TOREX 1
