Industry Directory | Manufacturer
Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.
Industry Directory | Manufacturer
Orbotech develops and produces the world's most advanced hi-tech equipment for inspecting and imaging circuit boards and display panels - the backbones of today's cutting-edge electronic products.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
New Equipment | Rework & Repair Equipment
BEST PCB circuit traces are designed to help you repair, replace and modify circuit traces on PCBs. These materials allow you to meet original PCB quality standards as the board side is microetched for improved bonding area and bond strength. The re
Used SMT Equipment | X-Ray Inspection
Description Make: VISCOM Model: 7056-II RL Year: 2010 Type: Wave Solder Details: Refurbished in 2021 by Viscom: In-line or can be used as standalone -The entire image chain is new.-New computers with Windows 10 IOT-New Digital flat p
Used SMT Equipment | Board Cleaners
Speedline Technologies AquaJet Stencil Batch Cleaner and Resys ClosedLoop System For Sale The wash needs a control board. (Part Description: BL1700 CNTRL 16IN 16OUT) The Part Number to Purchase this board is 20-101-0214. Estimated cost is $349. We h
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Technical Library | 2019-05-29 23:10:30.0
There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a "one and done" assembly will be made that there will be some SMT assemblers who choose to hand print solder paste onto the board using a "frameless" stencil. In such cases where hand printing is used, the consistency of the printing technique has typically been in question. Furthermore, the effectiveness of both the nanocoatings as well as the higher end stainless steel materials, which have been heretofore studied in controlled printing environments, will be evaluated for their impact on the hand printing process.The purpose of the study was to determine the effectiveness of select nanocoating materials as well as certain high end stainless steel stencil materials as they relate to the manual SMT printing process. A variety of nanocoatings were applied to SMT metal stencils and solder paste volume measurements were taken to compare the effectiveness.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
http://www.gpd-global.com Conformal coating (SimpleCoat) demonstration of the Spray Valve and Volumetric Pump in action on the SimpleCoat system. The Spray Valve sprays HumiSeal 1B31 from a height of approximately 20 mm above the board. The Volumetr
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Wed Jun 07 18:30:00 UTC 2023 - Wed Jun 07 18:30:00 UTC 2023 | ,
SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design
Events Calendar | Tue Apr 20 18:30:00 UTC 2021 - Tue Apr 20 18:30:00 UTC 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | Atlanta, Massachusetts USA | Sales/Marketing
Our client is the world leader in automated optical inspection (AOI) systems for use in the manufacture of printed circuit boards (PCB) and flat panel displays (FPD) and is a leader in imaging solutions for PCB production and in AOI systems for use i
Career Center | San Jose, California USA | Engineering
Headquartered in San Jose, as leading PC component distributor and rank #5 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR, SD-RAM, SO-DIMM and F
Career Center | Lake Mills, USA | Engineering,Management,Sales/Marketing
Sr Executive with over 17-years experience in contract manufacturing of printed circuit boards, wire harness/cable assembly, UL 508A control panel assembly/box builds, design/prototyping, and machining/fabrication.
Career Center | Minneapolis, Minnesota USA | Engineering,Management,Quality Control,Research and Development
Advanced Process/Manufacturing Engineer with many years of experience at multiple companies. Unique ability to perform and establish root cause. Designer, developer, and implementer of a wide variety of automated assembly systems, special projects,
SMTnet Express, June 15, 2023, Subscribers: 24,830, Companies: 11,818, Users: 28,067 █ Electronics Manufacturing Technical Articles Stencil Design For Mixed Technology Through-Hole / Smt Placement And Reflow This paper will review
-sectioning)is a technique, used
Imagineering, Inc. | https://www.pcbnet.com/blog/how-can-a-printed-circuit-board-help-you-test-a-circuit-board-schematic/
. PCB Schematic Symbols There are several symbols you’ll need to know if you want to read and design a circuit board schematic. Resistors are represented on a schematic by zig-zag lines or a plain rectangle
Heller Industries Inc. | https://hellerindustries.com/parts/591035/
591035 - ELECTRICAL PANEL Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
