Industry Directory | Manufacturer
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
Industry Directory | Manufacturer
Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.
ASCEN-PCB multi cutter separator applies to automatic online separate the PCB board. At the same time, the minimum cutting length can achieve 100mm and no limits of the cutting length. High efficiency multi cutter PCB depeneling machine's minimu
New Equipment | Board Handling - Conveyors
LED panel magazine loader is designed for unloading of PCBs, an arriving PCB is taken up by the attached conveyor and then pushed into the magazine by a specially designed pusher. The magazine indexes to the next position and is ready for the followi
Electronics Forum | Thu Sep 02 15:01:52 EDT 2010 | James Neal
Manufacturing-wise, is there a problem with doing a single panel with both four layer and two layers designs on it? I do prototype runs with multiple designs on the same panel, and I'd like to start including four layer. It seems to me that I can g
Electronics Forum | Thu Aug 10 11:32:34 EDT 2017 | dleeper
You could always take a scrap board, paste it, and let it sit out over night. Reflow it and then you should have a nice visual aid, covered in solder balls and grainy, irregularly shaped solder mounds.
Used SMT Equipment | Soldering - Selective
Make: Nordson ACE Model: KISS 103ILDP Description: This is Dual Pot Inline selective soldering system, with two selective soldering machines, tied together that can be run independently OR as a single inline selective system. This syste
Used SMT Equipment | Board Cleaners
Upgraded and maintainted over the years Previously owned by military contractor High pressure pump for SMD cleaning Computer controlled and monitored Designed for solvent-based cleaning and testing applications Multiple Cleaning T
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Parts & Supplies | SMT Equipment
SMT parts JUKI 2010 2020 2030 Z SLIDER SHAFT ASM E30507290A0 use on JUKI Pick and Place Machine Specifications: Brand Name JUKI Z SLIDER SHAFT Part number E30507290A0 Model Number Ensure Test in machine confirmation Guarantee One month u
Parts & Supplies | Assembly Accessories
JUKI NGA JIP PLATE A ASM E21499980A0 We are Supply SMT Pick and Place Equipment spare parts(Smt nozzle, Smt Cylinder, Smt Valve, Smt Sensor, Smt Feeder, Smt CPU Board, Smt Laser, Smt driver, Smt ejector……) for Yamaha, JUKI, FUJI ,Panasonic, Samsun
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
PCB magazine loader and PCB magazine unloader loading orunloading the PCB board on assembly line, check the detial for: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/87.html multi magazine PCB loader is used at the starting of the
http://www.pcb-separator.com/plus/view.php?aid=86 ??????????? ???????? ????/LED separating/LED panel separating/PCB depaneling device/???????/online separating
Events Calendar | Thu Jun 08 00:00:00 EDT 2023 - Thu Jun 08 00:00:00 EDT 2023 | ,
SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design
Career Center | Atlanta, Massachusetts USA | Sales/Marketing
Our client is the world leader in automated optical inspection (AOI) systems for use in the manufacture of printed circuit boards (PCB) and flat panel displays (FPD) and is a leader in imaging solutions for PCB production and in AOI systems for use i
Career Center | Racine, Wisconsin USA | Engineering
Cree currently has a job vacancy for an SMT Process Technician in our Lighting Manufacturing facility in Racine, Wisconsin. Summary: This person will be a primary contributor to the startup of a new SMT production line for LED PCB Assembly. This
Career Center | Palm Bay, Florida USA | Engineering,Production
1 year of SMT production experience in a low/med volume, high mix environment. IPC-A-610 Certified Specialist. Reflow profiling experience Heavy CAM programming experience with prototypes and new products
Career Center | Vestal, New York USA | Engineering,Research and Development
Experienced Sr./Principal Software Engineer and Systems Analyst in various applications, especially embedded real time systems and device drivers and board support including 80x86, Power PC, Motorola 68K, TI DSPs and a number of other platforms using
Cleanliness of Stencils and Cleaned Misprinted Circuit Boards Cleanliness of Stencils and Cleaned Misprinted Circuit Boards There are long-established standards and test methods for ionic cleanliness levels for bare printed circuit boards
Imagineering, Inc. | https://www.pcbnet.com/blog/hdi-microvias-and-printed-circuit-boards/
. What Are Vias in a Printed Circuit Board? Most printed circuit boards on the market today are built with several dielectric layers, surfaces that are polarized so that electricity
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SMT feeder spare part 00348942S01 Siemens/ASM Cable control panel Distribuitor panel siemens S series feeders Leave a Message We will call you back soon
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
