Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
Desktop covenyor Reflow Oven R350 from prototyping to full production. Desktop covenyor Reflow Oven R350 from prototyping to full production. Product Description Introduction: R350 mini reflow oven R350 is the first inline lead free reflow oven
Electronics Forum | Sun Sep 23 18:59:59 EDT 2007 | darby
I presume you are looking at low melting point solders. Firstly, I would consider running BOTH sides with the same paste - this will cut down the opportunities for a mix up with rework or retro-fit. Secondly, check that there is a cored wire availabl
Electronics Forum | Sun Mar 18 23:01:11 EDT 2007 | diesel_1t
Hi there, I want help on the following issue. Where I work, we place a component QFP 256 terminals (20 mil pitch)from hitachi (renesas), we use a MPM UP-3000 screen printer, IP-III placement machine and Vitronics 8 zones reflow Oven. lead plating
Used SMT Equipment | Soldering - Selective
ACE KISS 104 Selective Solder Model: KISS 104 Vintage: 2007 Voltage: 115/120 Two (2) pots - One leaded, one lead-free FEATURES: The KISS-104 is a fully configured In-Line SMEMA compatible Selective Soldering Machine ready to produce your produ
Used SMT Equipment | Soldering - Reflow
Speedline Omni 7 Reflow Oven Model: Omni 7 Vintage: 2003 Warranty: 30 Days THE OMNIFLO Each OmniFlo model features the same design criteria and the same robust construction. Our central design theme is to minimize the number of parts in the
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2017-04-22 12:38:58.0
MIRTEC, “The Global Leader in Inspection Technology,” today announced they will display their award-winning 3D AOI and SPI Inspection Systems in pb tec’s booth, in Hall 4A, Stand 140 at the upcoming SMT/Hybrid/Packaging Show, scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.
Technical Library | 2014-09-18 16:48:26.0
Two major drivers in electronic industry are electrical and mechanical miniaturization. Both induce major changes in the material selection as well as in the design. Nevertheless, the mechanical and thermal reliability of a Printed Circuit Board (PCB) has to remain at the same high level or even increase (e.g. multiple lead-free soldering). To achieve these reliability targets, extensive testing has to be done with bare PCB as well as assembled PCB. These tests are time consuming and cost intensive. The PCBs have to be produced, assembled, tested and finally a detailed failure analysis is required to be performed.This paper examines the development of our concept and has the potential to enable the prediction of the lifetime of the PCB using accelerated testing methods and finite element simulations.
Technical Library | 2016-02-11 18:26:43.0
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation temperatures increased, but also the chemistry of the solder paste was modified to meet the higher thermal requirements. Miniaturization is a second factor that impacts the reflow process. The density on the assembly is increasing where solder paste deposit volumes decreases due to smaller pad and component dimensions. Pick and place machines can handle more components and to meet this high through put some SMD lines are equipped with dual lane conveyors, doubling solder paste consumption. With the introduction of pin in paste to solder through hole components contamination of the oven increased due to dripping of the paste.
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | cabuyao, Philippines | Engineering
I had 9 years working as a technician starting in Smart electronic)as Mainline Technician. SGIC(Sanritsu Great International Corporation) as SMT mainline Techinician and IMI (Integrated Micro-Electronics INC,)as SMT Process Technician.
| https://www.eptac.com/faqs/ask-helena-leo/ask/shelf-life-of-soldered-components
component storage, environment used to store component until soldered, and handling methods used on the component until soldered. Solderability of component leads is included in EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Blackfox Training Institute, LLC | https://www.blackfox.com/beginners-guide-to-surface-mount-soldering/
. Then, grab the component with tweezers and carefully align its pins with the soldered pads. While keeping the pins correctly aligned, use the soldering iron with your other hand to heat one of the pins, and reflow the solder onto the pad to tack the component into place
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