Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Consultant / Service Provider
Zestfloor is End to End TRACEABILITY MES Solution for EMS /SMT Factories . Machine data acquisition from SPI /Mounter /AOI WIP ERP Interface
ASCEN-PCB multi cutter separator applies to automatic online separate the PCB board. At the same time, the minimum cutting length can achieve 100mm and no limits of the cutting length. High efficiency multi cutter PCB depeneling machine's minimu
ASCEN-PCB multi cutter separator applies to automatic online separate the PCB board. High efficiency multi cutter PCB depeneling machine can directly connect the reflow oven and pick and the pick and place machine on the SMT production line. Th
Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam
We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l
Electronics Forum | Thu Sep 13 22:06:02 EDT 2007 | davef
While you're waiting for others to respond, here's one take on bismuth in lead-free soldering [ http://smt.pennnet.com/Articles/Article_Display.cfm?Section=Articles⊂section=Display&ARTICLE_ID=229915 ] by a long term friend of SMTnet. Find more by sea
Used SMT Equipment | Soldering - Reflow
Hours – 35941Condition – all features work, recently replaced multiple heaters and fans with new factory parts.Flow – left to rightPower requirements – 480V 100AEdge rail, adjustable rail with chain conveyorMesh belt
Used SMT Equipment | AOI / Automated Optical Inspection
- 8 CAMERAS(5 MEGA PIXEL CAMERA) • High performance inspection for 01005 components • New 5.0 megapixel CMOS color cameras • 17 micron camera resolution • Dual-core dual-processor computer • Line-speed inspection for demanding cell phone and
Industry News | 2015-02-11 05:27:25.0
A "Sealed Bid" Auction with SMT electronic manufacturing equipment from multiple customers in the USA opened February 9, 2015 and closes February 24, 2015 at 5:00 pm EST.
Industry News | 2015-02-20 10:40:18.0
Baja Bid’s latest online auction with equipment from multiple customers in the USA will close on February 24, 2015.
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-12-15 03:06:24.0
The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
http://www.pcb-separator.com/plus/view.php?aid=86 PCB multi cutter machine/high efficiency PCB depaneling 900 machine/ PCB separator
http://www.pcb-separator.com/plus/view.php?aid=86 PCB multi cutter machine/high efficiency PCB depaneling 900 machine/ PCB separator
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | Arlington Heights, Illinois USA | Maintenance
Major Responsibilities are as follows: Creating and updating programs for pick and place equipment and reflow ovens Instituting ECN/BOM Documentation in accordance with ISO guidlelines Performing all necessary repairs and monthly preventative mainte
Career Center | San Jose, California USA | Research and Development
Join this team focused on RF Modules for the rapidly expanding Cellular and Wireless Data markets. You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Wireless Semiconductor Division (WSD) of Avago T
Career Center | Nashville, North Carolina USA | Engineering,Maintenance,Management,Sales/Marketing,Technical Support
Screen Printer programming, maintenance, calibration Placment machine programming, mainteanance, calibration SMT Process and Manufacturing engineering Project Management New model introduction Supervision skills Training skills Leadership knowledge S
Career Center | Fort Worth, Texas USA | Engineering,Maintenance,Production,Quality Control,Research and Development
A mechanically-inclined, results-oriented, lean-driven professional with proven success in implementing programs that result in efficiencies and cost savings. Effectively communicates with diverse audiences, encourages training and employee developme
SMTnet Express, March 30, 2017, Subscribers: 30,363, Companies: 10,588, Users: 23,069 Multiple Methods for Applying Paste Flux or Solder Paste for BGA Rework Bob Wettermann; BEST Inc. , MIT There are multiple methods, each with its
| https://www.smtfactory.com/Reflow-Oven-pl3589223.html
machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs). Reflow ovens contain multiple individually heated zones, which can be individually controlled for temperature
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/hot-bar-reflow-soldering-systems?con=t&page=4
. By using Hot Bar Reflow Soldering process multiple connections (up to > 100mm length) can be made simultaneously in a single process cycle
