Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Manufacturer
GMA IS A CONTRACT MANUFACTURER OF PRINTED CIRCUIT BOARD ASSEMBLIES, TESTING AND INTEGRATION INTO HIGHER LEVEL ASSEMBLIES OR PRODUCTS.
ASCEN-PCB multi cutter separator applies to automatic online separate the PCB board. At the same time, the minimum cutting length can achieve 100mm and no limits of the cutting length. High efficiency multi cutter PCB depeneling machine's minimu
ASCEN-PCB multi cutter separator applies to automatic online separate the PCB board. High efficiency multi cutter PCB depeneling machine can directly connect the reflow oven and pick and the pick and place machine on the SMT production line. Th
Electronics Forum | Thu Jan 22 09:21:45 EST 2004 | davef
Oh, another thing, we do not like to probe copper. It's hard, compared to solder, and beats-up the probes too much. [As Patrick Bruneel states in this thread.] Consider reflowing paste on your test pads.
Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam
We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l
Used SMT Equipment | Soldering - Reflow
Hours – 35941Condition – all features work, recently replaced multiple heaters and fans with new factory parts.Flow – left to rightPower requirements – 480V 100AEdge rail, adjustable rail with chain conveyorMesh belt
Used SMT Equipment | AOI / Automated Optical Inspection
- 8 CAMERAS(5 MEGA PIXEL CAMERA) • High performance inspection for 01005 components • New 5.0 megapixel CMOS color cameras • 17 micron camera resolution • Dual-core dual-processor computer • Line-speed inspection for demanding cell phone and
Industry News | 2015-02-11 05:27:25.0
A "Sealed Bid" Auction with SMT electronic manufacturing equipment from multiple customers in the USA opened February 9, 2015 and closes February 24, 2015 at 5:00 pm EST.
Industry News | 2015-02-20 10:40:18.0
Baja Bid’s latest online auction with equipment from multiple customers in the USA will close on February 24, 2015.
Parts & Supplies | Pick and Place/Feeders
JUKI EA9500B0000 CLIP CV-70S www.fujintai.com JUKI EA9500B0100 CABLE BAND FUJINTAI TECHNOLOGY CO.,LTD JUKI EA9500B0200 CABLE BAND 150 www.fujintai.com JUKI EA9635B0000 SOCKET FUJINTAI TECHNOLOGY CO.,LTD JUKI ES000175000 8 STAINLESS TUBE N2 www.fu
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Parts & Supplies | Pick and Place/Feeders
Supply&repair juki spare parts at l lower price: JUKI 710(720) CARRY UNIT E86127150B0 JUKI 710(720) CPU CARD E8601715AA0 JUKI 730(740) CARRY BOARD E86067210A0 JUKI 730(740) DC SERVO DRIVER E86037210A0 JUKI 750(760) AC SERVO CARD E86027210A0
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-12-15 03:06:24.0
The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
http://www.pcb-separator.com/plus/view.php?aid=86 PCB multi cutter machine/high efficiency PCB depaneling 900 machine/ PCB separator
http://www.pcb-separator.com/plus/view.php?aid=86 PCB multi cutter machine/high efficiency PCB depaneling 900 machine/ PCB separator
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | Arlington Heights, Illinois USA | Maintenance
Major Responsibilities are as follows: Creating and updating programs for pick and place equipment and reflow ovens Instituting ECN/BOM Documentation in accordance with ISO guidlelines Performing all necessary repairs and monthly preventative mainte
Career Center | , | Engineering
Lead Process Engineer - Utah � Will develop, implement, and maintain PCB assembly processes including screen printing, placement, reflow, and automated optical inspection. � Implement engineering changes from customers. � Prepare and maintain pro
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
| https://www.smtfactory.com/Reflow-Oven-pl3589223.html
machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs). Reflow ovens contain multiple individually heated zones, which can be individually controlled for temperature
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/reflowevolution.pdf
. When several incremental advances operate in combination on multiple systems in multiple locations, the resulting synergies can generate dramatic overall improvements in reflow yield and quality.
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