Pfeiffer Vacuum is the leading manufacturer for vacuum technology, vacuum pumps and vacuum solutions: From a single component to complex vacuum systems.
Industry Directory | Distributor / Manufacturer
Equip-Test with Global Headquarter in Budapest Metropolitan Area, Europe is a global player in manufacturing PCB test equipment.
JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603～50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603～50mm, Place Speed:15,500 CPH
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
Electronics Forum | Thu Jul 27 16:54:46 EDT 2006 | pjc
In-Circuit test, or ICT, is the most common method of electrical test for an assembled PCB. It is the most comprehensive and accurate method to ensure that both the PWB and components are working to specification. Not all components however can be el
Electronics Forum | Mon Feb 26 12:26:43 EST 2001 | CAM
I'm working a problem and looking for your input. Here the deal: Two sided mix technology board. Test is using unmasked via points on bottom for test points. Our fab drawing states tent via points on top side. First set of board came in with no tenti
Used SMT Equipment | Pick and Place/Feeders
Features: S/W: 2.8.1f Dual Vision Camera Agilis Capable Electrical Two-Pole Test Electrical Transistor Test Optical Centering Z High Speed (Midas Head) Autoteach Linescan for Z Hydra Condition: Complete & Operational
Used SMT Equipment | Pick and Place/Feeders
Software: 2.9.x T3 Linear Table Electrical Two-Pole Test Electrical Transistor Test Optical Centering Conveyor Shared Databases Hydra Z High Speed Hydra High Speed Autoteach Linescan for Z Line Mode Fast Place Sequence
Industry News | 2021-12-09 09:26:46.0
Baja Bid is liquidating excess equipment via online auction. The bidding for this event is now open and the closing will begin today at 1:00 pm EST.
Industry News | 2011-03-24 11:31:33.0
Count On Tools introduces MYDATA Replacement Inline Filters and Filter Housing components. Count On Tools replacement inline filters have been field tested and are proven to increase vacuum and air performance in the equipment while lasting longer than OEM versions. The new inline filters are capable of capturing particles as small as 0.1 µm.
Parts & Supplies | SMT Equipment
CP40 vacuum valve if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP:
Parts & Supplies | SMT Equipment
FUJI VACUUM PIN Name: FUJI VACUUM PIN Part No.: NDPH8171 Kindly contact me if you are interested. More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP: 0086-1317047
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2022-10-31 18:35:40.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Wed Jun 21 00:00:00 EDT 2017 - Sat Jun 24 00:00:00 EDT 2017 | Bangkok, Thailand
Assembly Technology Expo
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
Career Center | north augusta, South Carolina USA | Production,Quality Control
I am a skilled smt operator that pays close attention to detail! With my experience in the electronic field for the passed 10 years proving to be an asset to all companies that i have worked for in providing quality work and ensuring on time delivery
Lewis & Clark | http://www.lewis-clark.com/product-tag/my100/
=0 2011 Mydata My100 DXE-14 Pick and Place 2012 Mydata My100 SXE Pick and Place Make: Mydata Model: My100 SXE Vintage: 2012 Software: TPSys 2.9.25c Details: Electrical two-pole test Electrical transistor test Optical Centering Barcode Reader Conveyor Shared databases HYDRA Electrical measurement Z high speed HYDRA high speed Autoteach Linescan for Z Pre
Heller Industries Inc. | https://hellerindustries.com/test-chat/
test chat Phone 1-973-377-6800 Company About Reflow Soldering Videos News Events New Equipment Convection Reflow Ovens New MK7 Reflow Oven Dual Lane, Dual Temperature Reflow Oven Curing
