Pfeiffer Vacuum is the leading manufacturer for vacuum technology, vacuum pumps and vacuum solutions: From a single component to complex vacuum systems.
Industry Directory | Distributor / Manufacturer
Equip-Test with Global Headquarter in Budapest Metropolitan Area, Europe is a global player in manufacturing PCB test equipment.
JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603～50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603～50mm, Place Speed:15,500 CPH
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
Electronics Forum | Thu Jul 27 16:54:46 EDT 2006 | pjc
In-Circuit test, or ICT, is the most common method of electrical test for an assembled PCB. It is the most comprehensive and accurate method to ensure that both the PWB and components are working to specification. Not all components however can be el
Electronics Forum | Fri Jan 19 05:46:59 EST 2018 | ivammendes
MYDATA MY9E: Hydra's pipe can't stop the vacuum during assembly. The problem ocurre just in only one pipe, the number 5. The tool picks components but doesn't drop it. Can the problem be in the unit vacuum?
Used SMT Equipment | General Purpose Test & Measurement
TERADYNE, Testing Machine, type Spectrum 8800 Series, SN: 8855-088, with inside 30 cards modules, included Pentium PC inside, software Windows NT, Service Pack 6, with keyboard and flat screen, n.1 vacuum pump, size approx. 2, 30 x 1, 80x1, 60 meters
Used SMT Equipment | Pick and Place/Feeders
MyData MY9E Pick & Place Model: MY9E Vintage: 2006 Hydra & Midas Heads Electrical Two-Pole Test Electrical Transistor Test Shared Databases HYDRA Electrical Measurement HYDRA High Speed Line Mode HYDRA Large Component Range OS: TPSys 4.2.5j
Industry News | 2015-01-28 23:09:18.0
Baja Bid will be selling some electronic manufacturing equipment from one of their good customers in Horsham, Pennsylvania. The equipment is currently in production but is scheduled to be taken off-line in March of this year. There is no auction being planned at this time but sales orders are being taken with a release date during the month of March.
Industry News | 2015-02-11 05:27:25.0
A "Sealed Bid" Auction with SMT electronic manufacturing equipment from multiple customers in the USA opened February 9, 2015 and closes February 24, 2015 at 5:00 pm EST.
Parts & Supplies | SMT Equipment
CP40 vacuum valve if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP:
Parts & Supplies | SMT Equipment
FUJI VACUUM PIN Name: FUJI VACUUM PIN Part No.: NDPH8171 Kindly contact me if you are interested. More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP: 0086-1317047
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2022-10-31 18:35:40.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time.
00367018-02 TEST CABLE X2 00367019-02 TEST CABLE X3 00367071-01 Oil Dispenser z-Axis STRUCTVIS GHD 7ml 00367142S04 COMP.SENSOR SP-12 COMPL. 00367174-02 MOTOR WITH SYNCHRONIZING DISK 00367216-04 SIPLACE line utility box (10/2004) 00367237-01 GA
03003217-01 Computer Unit without MVS SIPLACE HF 03003232S01 STRIPPING PLATE / ROCKER X8 03003236S01 VACUUM GENERATOR ASSY SP-HF 03003261S01 Vacuumdistributor complete 03003268S01 Dual Holder for Vacuum Generator 03003277S01
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Wed Jun 21 00:00:00 EDT 2017 - Sat Jun 24 00:00:00 EDT 2017 | Bangkok, Thailand
Assembly Technology Expo
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
Career Center | north augusta, South Carolina USA | Production,Quality Control
I am a skilled smt operator that pays close attention to detail! With my experience in the electronic field for the passed 10 years proving to be an asset to all companies that i have worked for in providing quality work and ensuring on time delivery
SMTnet Express, August 17, 2017, Subscribers: 30,720, Companies: 10,649, Users: 23,665 The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability Richard Coyle, Richard Popowich, Charmaine Johnson - Nokia Bell
Heller Industries Inc. | https://hellerindustries.com/test-chat/
test chat Phone 1-973-377-6800 Company About Reflow Soldering Videos News Events New Equipment Convection Reflow Ovens New MK7 Reflow Oven Dual Lane, Dual Temperature Reflow Oven Curing
GPD Global | https://www.gpd-global.com/co_website/pdf/pbt/Wafer-Option-PBFT-PBT-3000M.pdf
Wafer Peel Back Test Wafer Peel Back Test Option Operating Guide Part No. PBT-3000M 07/19/07 ©2007 GPD 611 Hollingsworth Street, Grand Junction, CO 81505 USA tel: +1.970.245.0408 fax: +1.970.245.9674 email: request@gpd-global.com www.gpd
