Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer
Focusing on the SMT field for more than 15 years, QYSMT has been committed to meeting the needs of customers and partners. Our mission is to provide the best solutions while helping to reduce costs and increase efficiency.
Industry Directory | Manufacturer
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
Count On Tools specializes in custom engineered nozzles for all types of LEDs (Cree, Luxeon, Phillips, NIchia, Osram, etc). Recent growth in LED technology and solid state lighting has provided the electronics manufacturing industry with viable sol
New Equipment | Board Handling - Conveyors
Board train conveyors for higher throughput Increases overall throughput Automatic grouping of several PCBs Improves board transfer times Reduced number of nozzle changes Board train - for increasing throughput Board train is a
Electronics Forum | Fri May 14 16:49:17 EDT 2021 | winston_one
Agree with WiIIR and also can recommend to play with vaccum pump RPM . Slower vacuum increasing have help me to resolve one problem caused by the vacuum (it was solder splash from BGA balls, but the reason can be similar to your case). Also check i
Electronics Forum | Sat Jan 29 04:59:02 EST 2005 | Grant
Hi, MYDATA's are ok for lower volume, and they are very flexible. If you only have 1 or 2 trays of components and are on a tight budget, then you can even place the trays on the Y wagon behind the PCB so you can get away without the tray wagon. Al
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Used SMT Equipment | Pick and Place/Feeders
Samsung Pick And Place Machine Decan Series Decan S1 Model DECAN S1 Alignment Fly Camera + Fix Camera The number of spindles 10 spindles x 1 Gantry Placement Speed 47,000 CPH (Optimum) Placement Accuracy ±28μm @ Cpk≥ 1.0 Component Ran
Used SMT Equipment | THT Equipment
JUKI JM 50 Insertion Solution THT JUKI JM 50 Insertion Solution THT Lowest cost JUKI's JM-50 convinces with lowest entry costs for THT production when producing high-mix low-volume. Recognition of various component heights The new "Takumi head" has
Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
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Parts & Supplies | Pick and Place/Feeders
1.philips smt nozzle nafcm1 philips smt nozzle 0.88mmx0.50mm(custom) 946602747001 0.95mm×0.55mm(pa2747/00) 946602747201 1.3mm×0.88mm(pa2747/20) 946602747301 2.5mm×1.5mm(pa2747/30)nz. 2.philips topaz-x smt nozzle 5322 360 10
Parts & Supplies | Pick and Place/Feeders
Hydra miniature solenoid vacuum valve using for repairing Hydra vacuum unit L-012-0609 for Mycronic-Mydata MY9-19, MY100, MY200, MY300 machines. New. Unit sales. Available in stock View this part on LandrySMT web site: https://www.landrysmt.fr/p
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
Events Calendar | Wed Jun 27 00:00:00 EDT 2018 - Thu Jun 28 00:00:00 EDT 2018 | San Jose, California USA
Sensors West
Events Calendar | Tue Sep 11 00:00:00 EDT 2018 - Thu Sep 13 00:00:00 EDT 2018 | Novi, Michigan USA
Battery Show
Career Center | Van Nuys, California USA | Management
Position Responsibilities: SMT Supervisor: We are in the Efficiency business. To be efficient, the SMT Supervisor must focus on having effective people working for them. This enables the SMT Supervisor to work on high skill tasks. Daily: Organiz
Career Center | Van Nuys, California USA | Production
We are an ISO 9000, AS 9100, ISO 13485 and NASA certified; Quick Turn, High Reliability, Contract Manufacturer of PCB assemblies, located in the San Fernando Valley. We serve the aerospace, military, space, medical and telecommunications and other L
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
Career Center | north augusta, South Carolina USA | Production,Quality Control
I am a skilled smt operator that pays close attention to detail! With my experience in the electronic field for the passed 10 years proving to be an asset to all companies that i have worked for in providing quality work and ensuring on time delivery
Heller Industries Inc. | https://hellerindustries.com/vacuum-voidless-reflow-ovens/
Voidless / Vacuum Reflow Soldering Ovens Home » Voidless / Vacuum Reflow Soldering Ovens Voidless / Vacuum Reflow Soldering Ovens We offer vacuum reflow ovens with several different footprint and vacuum chamber size options, and are suitable for
| https://www.wesource.com/lab-equipment/busch-vacuum-pump-id-60221/
Busch Vacuum pump_ID 60221: World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159 CALL US: 858.693.1991 Home About Us Contact Us Categories AOI Assembleon Machines Assembleon Parts Batch Ovens and Chambers Component Counters/Tapers Component Placers (Pick
