New Equipment | Cleaning Equipment
PCBA CLEANING MACHINE 5600 PCBA CLEANING MACHINE SMT CLEANING MACHINE Demensions:600 x 1000 x 1600mm PCB width:50-400mm PCB Length:Max 460mm Pitches:10,20,30mm Product description: PCBA CLEANING MACHINE 5600 INQUIRY PCBA CLEANING MAC
.jpg)
New Equipment | Selective Soldering
High Performance Offline Selective Wave Soldering Equipment Selective wave soldering is a special form of wave soldering invented to meet the development requirements of through-hole components soldering. It is mainly suitable for the soldering of
Used SMT Equipment | Board Cleaners
Speedline Electrovert Aqueous Cleaning System In-line Cleaner Model: Aquastorm 200 (Torrid Zone) Year: 2004 S/N 480409 Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray manifolds Valve switching to div
Used SMT Equipment | Board Cleaners
Speedline Electrovert Aqueous Cleaning System Brand: Speedline Model: Aquastorm 200 (Torrid Zone) Serial #: 480409 Year: 2004 Type: In-line Cleaner Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray m
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2012-10-01 16:17:38.0
Count On Tools Inc announces the re-launch of the MYDATA Exchange Program for new customers.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
SMT is surface assembly technology, a new generation of electronic assembly technology developed from hybrid integrated circuit technology. SMT production line is also called surface assembly technology. Full-auto SMT Production Line is a new generat
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
| http://etasmt.com/cc?ID=te_news_bulletin,14961&url=_print
. The second is the application of solder alloys with different melting points. The alloy with a higher melting point is used for the first side and the alloy with a lower melting point is used for the second side
| https://www.eptac.com/the-5-essential-tools-for-soldering/
. Keep in mind that the solder should have a lower melting point than the materials that are being joined. This will allow the solder to melt first and bond the materials together
