Industry Directory | Manufacturer
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
WE SPECIALISED IN SMT MACHINERIES AND PERIPHERAL EQUIPMENTS SERVICING, RENTAL & TRADING MACHINES
New Equipment | Board Handling - Conveyors
The destacker separates single boards from the bottom of the stack and transports them one by one onto the production line. If the unit becomes empty, or the destacking switch is turned off, the conveyor starts to work as a regular transport conveyor
New Equipment | Board Handling - Storage
Automated & MSD compliant storage. The MYDATA SMD Tower provides more intelligent and automatic access to component reels and trays. The MYDATA SMD Tower boosts production efficiency with: Fast storage and retrieval of components. Auto
Electronics Forum | Tue Feb 06 18:46:13 EST 2007 | darby
Imagine you put two 8mm feeders on the rear feeder plate, they are about the same distance apart as the length of your tray. On top of these feeders are two slotted arms that allow you to move the arms towards the moveable rail. You place your tray o
Electronics Forum | Wed Jul 13 08:42:02 EDT 2005 | mikeattekfab
I am looking for an additional Tray wagon for our Mydata machines, anyone have a working one they do not need? Please let me know. Mike
Used SMT Equipment | Pick and Place/Feeders
We have several lots of Mydata Agilis feeders & magazines available for purchase in our upcomong online auction. https://bajabid.hibid.com/catalog/371611/june-13-15--2022-online-auction/? Items including: -Mydata LM8 Magazines -Mydata M8
Used SMT Equipment | Pick and Place/Feeders
This equipment is located in our upcoming STS Online Auction - February 25 - 28, 2019 S/W: 2.8.2b T5 Y Wagon Midas Head Hydra Head Agilis Compatible 14 Magazine Slots Large Tray Wagon Serial: 19120
Industry News | 2003-01-24 09:07:53.0
For Industrial, Telecom and Datacom Use
Industry News | 2022-06-13 13:10:34.0
Items Including – 2014 ACE KISS 102 Selective Solder, 2014 On-Site N25T Nitrogen Generator, 2014 RPS FRX16 Selective Solder, Vitronics XPM2-940 Reflow Oven, 2008 Aqueous SMT600-CL Batch Washer, 2005 DEK Horizon 03 Screen Printer, 2004 Heller 1088EXL Reflow Oven, [2] 2002 BTU Pyramax 98A Reflow Ovens, 2001 Scorpion FLS650 Flying Prober, Mydata TM Style Magazines, Mydata Agilis Magazines, Mydata Agilis Feeders, Mydata Tray Wagons, [2] Bliss Pallet Racks & much more...
Parts & Supplies | Pick and Place/Feeders
JUKI E2228725000 STOPPER FRAME FR FUJINTAI TECHNOLOGY CO.,LTD JUKI E22287250B0 STOPPER FR ASM www.fujintai.com JUKI E2228998000 DIAL GUAGE PLATE (M200) FUJINTAI TECHNOLOGY CO.,LTD JUKI E2229725000 STOPPER FRAME FL www.fujintai.com JUKI E22297250B
Parts & Supplies | Pick and Place/Feeders
> www.fujintai.com JUKI E2604706C00 REEL SUPPORT BLACKET FUJINTAI TECHNOLOGY CO.,LTD JUKI E2604716000 TRAY HOLDER SEAT www.fujintai.com JUKI E2604719000 STICK HOLDING BASE LEVER SHAFT FUJINTAI TECHNOLOGY CO.,LTD JUKI E2604721000 PLATE STAND R www
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
Attractive price smt multi magazine loader with CE certificate APPLICATION: The Single magazine loader is used at the starting of the line for loading of PCB’s to the production line. The unit loads the production line automatically by pushing PCB’
Yamaha YC8 Chip Shooter Compact Modular Odd Form Placement ❙ Features of Yamaha SMT YC8 Odd Form Placement Yamaha compact modular PCB chip shooter, Yamaha SMT chip shooter machine, applicable PCB size, L50 x W50mm to L330 x W360mm, YC8 Odd For
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
Career Center | San Pablo City, Laguna, Philippines | Engineering,Maintenance,Production,Sales/Marketing,Technical Support
Some key points you may find relevant to this job opportunity include: Extensive experience and knowledge on Service and Technical skills by performing Set-up, Buy-off, troubleshooting of the assigned Equipments. Provide solution to custom
SMTnet Express, April 16, 2015, Subscribers: 22,628, Members: Companies: 14,302, Users: 38,055 Stereo Vision Based Automated Solder Ball Height Detection Jinjin Li, Lina J. Karam; School of Electrical, Computer, & Energy Engineering, Arizona State
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_mydata_tex.html
Mydata Tex Mydata Automation Tex Tray Tower Equipment Description Mydata Automation Model Number: TEX Tower Serial Number: 158 Year 11/21/2000 Up to 32 JEDEC Matrix Trays Pallet Dimensions
| https://pcbasupplies.com/smt-equipment/mycronic-mydata/
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