DZ-10GV22-1A DZ-10GV22-1B DZ-10GW-1A DZ-10GW-1B DZ-10GW2-1A DZ-10GW2-1B DZ-10GW22-1A DZ-10GW22-1B E22-01 1M E2CA-AL4C E2CA-AL4D E2CA-AL4E E2CA-AL4F DC12-24 E2CA-AN4C E2CA-AN4D E2CA-AN4E E2CA-AN4F AC100-240 E2C-AK4A E2C-AM4A E2CA-X10A 3M E2CA-X10A 5M
Parts & Supplies | Pick and Place/Feeders
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Technical Library | 2023-06-14 01:09:26.0
In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are often highly sensitive to the Anand parameters. In this work, an investigation on the Anand constitutive model and its application to SAC solders of various Ag contents (i.e. SACN05, with N = 1, 2, 3, 4) has been performed. For each alloy, both water quenched (WQ) and reflowed (RF) solidification profiles were utilized to establish two unique specimen microstructures, and the same reflow profile was used for all four of the SAC alloys so that the results could be compared and the effects of Ag content could be studied systematically.
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