Industry Directory | Manufacturer
Manufacturer of automated machinery for selective conformal coating, fluid dispensing, plasma treatment, assembly machines, and complete factory process line solutions.
Industry Directory | Manufacturer
Tangteck Equipment Inc is a leading furnace manufacturer in Taiwan. Which provide SMT Air/N2 Reflow Furnace, Thermal Profiler, High Temperature Air/N2 Firing Furnace and customized soluition.
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
Electronics Forum | Fri Jan 31 14:06:09 EST 2003 | MA/NY DDave
Hi Wow, I can't imagine this set up. No wonder some of us were coming from opposing directions. My thoughts would be to buy another pot if needed and not go to N2. Do you have a site that we could look at the dynamics of this N2 air knife/ solder
Electronics Forum | Fri Mar 11 03:23:58 EST 2005 | py (france)
ken, in order to improve the wettability I suppose.... But it seems that jimk wants N2 for the reflow owen even if he does not need N2... ==== jimk: see air-liquide, linde gaz, and praxair , you can by N2 liquid in tank , or any other conditionnemen
Used SMT Equipment | Soldering - Reflow
TNV25-508EM Feature: · New heat insulation Design with Energy Saving Effect · N2 consumption largely reduced · Air conditioning load also reduced · Power consumption about 40％ reduced · N2 consumption abou
Used SMT Equipment | Soldering - Reflow
Vitronics XPM3 1030 Reflow Oven Vintage: 2006 Edge Rail, Mesh Belt AND Center Board Support! Air with N2 Capability Under 45K Usage hours! Please contact us for additional photos, details and videos~
Industry News | 2022-11-21 15:50:26.0
ITW EAE is releasing a new feature for the Electrovert Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing. When the wave flow is fully optimized, the PCB 'peels' away from the solder which minimizes the opportunity for bridging defects to occur.
Industry News | 2015-09-03 16:37:18.0
SMTA China announces that it presented awards for seven papers at the SMTA China South 2015 Conference Award Presentation Ceremony, held on Tuesday, August 25, 2015 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.
Parts & Supplies | SMT Equipment
Yamaha PBSA 16X30-7-1062W air cylinder More Yamaha parts in stocks KG3-M7190-00X Yamaha Needle Connector 12YM KGT-M7106-00X Yamaha YG200 Shaft Nozzle Holder KHN-M7720-A1X Yamaha YS12 302A Nozzle KHN-M7790-A1X Yamaha YS12 309# Nozzle KHY-M7106
Parts & Supplies | Pick and Place/Feeders
YAMAHA YV100XG KV8-M4570-02X IO HEAD UNIT ASSY More Yamaha SMT parts in stocks KG3-M7190-00X Yamaha Needle Connector 12YM KGT-M7106-00X Yamaha YG200 Shaft Nozzle Holder KHN-M7720-A1X Yamaha YS12 302A Nozzle KHN-M7790-A1X Yamaha YS12 309# Nozzl
Technical Library | 2017-07-06 15:50:17.0
Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.
Make: Vitronics Soltec Model: XPM3 1030 Vintage: 2006 Details: • Air • N2 Compatible • Edge Rail and Mesh Belt Conveyors • Center Board Support Condition: Complete & Operational Location & Shipping: USA / FOB Origin, N
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Career Center | kemaman, malaysia Philippines | Maintenance,Production,Technical Support
• Conduct repairs and troubleshooting of production equipment to avoid / minimize production downtime. • Performs preventive maintenance of production equipment as defined in work procedure and according to their schedule of frequency. • C
Career Center | San Pablo City, Laguna, Philippines | Engineering,Maintenance,Production,Sales/Marketing,Technical Support
Some key points you may find relevant to this job opportunity include: Extensive experience and knowledge on Service and Technical skills by performing Set-up, Buy-off, troubleshooting of the assigned Equipments. Provide solution to custom
Lewis & Clark | http://www.lewis-clark.com/product-tag/reflow-oven/page/2/
: Vitronics Soltec Model: XPM3 1030 Vintage: 2006 Details: Air N2 Compatible Edge Rail and Mesh Belt Conveyors Center Board Support Condition
| http://www.szhonreal.com/productview.asp?id=44
required air flow 8-12L/min required N2 pressure 3-4 Bars required N2 flow more than 2cubic meter per hour required N2 purity >99.998% required exhausting 500--800CMB/H carrier or PCB carrier according product max carrier size L400 x W400 mm
