Industry Directory | Distributor / Manufacturer / Manufacturer's Representative
European supplier of Lead Free solder products like the paste compositions SnZnAl (low melting point), SAC, SnBi, flux, BGA Balls, solder wire, N2 Reflow Systems.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
New Equipment | Wave Soldering
Wave Soldering Machine SMT wave soldering machine SMT wave soldering machine for PCB Manufacturing... SMT wave soldering machine SMT wave soldering machine Manufacturer... Mini SMT Assembly line wav Mini SMT Assembly line wave soldering m
New Equipment | Selective Soldering
Flason SMT Online Single Head Selective Wave Soldering Machine max solder temperature 350℃ solder pot capacity 15 KG dimension L1280mm X W1400mm X H1650mm Net weight 380KG Product description: Online Single Head Selective Wave Soldering
Electronics Forum | Mon Aug 16 05:42:53 EDT 1999 | Omat Marasigan
Hello reflow experts, I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. thanks in advance.... ...Omat
Electronics Forum | Mon Aug 16 09:50:20 EDT 1999 | Earl Moon
| Hello reflow experts, | | I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. | | thanks in advance.... | | ...Omat | | Not really that much with eutectic balls and solder pasted pads and the reflow
Industry News | 2011-01-20 13:45:14.0
IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.
Industry News | 2016-03-10 19:04:14.0
Seika Machinery will debut two additional new products at the 2016 IPC APEX EXPO. A new McDry Cabinet and Eightech reflow soldering system will be introduced at the show.
Parts & Supplies | Pick and Place/Feeders
KHY-M221A-A0 KGT-M221A-A0 YAMAHA YG12 tank chain gland KHY-M2267-00 YG12 tank chain YS12 towline keel X axis PISCO SP2550 R75 KHY-M2276-S0 YS12 screw X-axis YG12 X-axis screw YG12F YS12F screw guide KHY-M371R-00 RAIL GUIDE 12P YS24 YS100 Feida pl
Technical Library | 2017-07-06 15:50:17.0
Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.
| http://www.szhonreal.com/productview.asp?id=44
. Customer can add more same module and connect for higher production, more flexibility. 4. Full PC control. All parameters can set in PC and saved to PCB menu, like moving path, solder temperature, flux type, solder type ,n2 temperature etc, best trace-ability and easy to get repeat soldering quality
| https://www.smtfactory.com/Full-auto-Online-Selective-Wave-Soldering-Machine-I-C-T-SS550-pd47993093.html
. All parameters can set in PC and saved to PCB menu, like moving path, solder temperature, flux type, solder type ,n2 temperature etc, best trace-ability and easy to get repeat soldering quality. 5
