Improvement of Organic Packaging Thermal Cycle Performance Measurement Featured Article Improvement of Organic Packaging Thermal Cycle Performance Measurement Endicott Interconnect Technologies Glenn O. Dearing, Paul J. Hart Flip Chip Plastic
GPD Global | https://www.gpd-global.com/co_website/pdf/pbt/PBFT-VS-SPC-User-Guide-20041102-PBT-002_CD-FORCEWare-v3-3.pdf
. Applying force to this precision instrument at an excessive speed may result in permanent damage to the unit. Strain Gauge - Force DO NOT apply more than 1 kilogram of force to the strain gauge clip