Industry Directory | Consultant / Service Provider / Manufacturer
From the Irvine, CA office Nanovea began designing and manufacturing instruments after years of experience in providing solutions for profilometry, mechanical and tribology applications.
Industry Directory | Manufacturer
As trends towards the miniaturization and increased functional integration of electronics, the demands on quality assurance are rising. FISCHER has many coating thickness measurement solutions for the electronics sector.
New Equipment | Test Equipment
The CSM Instruments Table Top Instrument places the performance of the standard Nanoindentation Tester (NHT) into a small and simple-to-use instrument which is ideally suited to routine nanoindentation testing where a full platform configuration may
New Equipment | Test Equipment
THE NEW GENERATION OF NANOINDENTER CSM Instruments has introduced a new nano range high resolution nanoindenter with ultra low thermal drift. When used per ISO 14577 test methods the Ultra Nano Hardness Tester will provide the most accurate data of
Industry News | 2012-01-20 11:37:53.0
Nanovea today announced the arrival of the N3 line dedicated to providing high-end measurement technology to the broader market. Nanovea has fully automated their measurement techniques while designing to price in the $20K market.
Industry News | 2011-03-01 16:38:55.0
Nihon Superior Co. Ltd. announces that Keith Sweatman, Senior Technical Advisor, will present a paper titled "The Stability Window and Mechanical Properties of the Interfacial Intermetallic in Lead-free Solder Joints" at the upcoming TMS 2011 Annual Meeting & Exhibition.
Technical Library | 2016-10-20 18:13:34.0
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.
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