Industry News: nexx (7)

International Wafer-Level Packaging Conference (IWLPC) Features Five Half-Day Tutorials

Industry News | 2009-08-07 19:24:15.0

Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

SMTA Announces IWLPC 2010 Featured Tutorials

Industry News | 2010-08-17 14:08:36.0

The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)


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