Industry Directory: ni, (12)

NiMar Group

Industry Directory | Manufacturer's Representative

Over 30 years experience in the electronics, and electrical assembly. Experienced in soldering and assembly technologies.

Mindready Solutions (NI) Ltd

Industry Directory | Manufacturer

Mindready, a leading supplier of manufacturing automation and test engineering solutions, offers a comprehensive range of industrial test solutions from x-ray, in-circuit, functional and environmental testing to design, development and integration of complete test stations

New SMT Equipment: ni, (134)

Fabricante de Placas de Circuito Impreso Flexibles-Rígidas

Fabricante de Placas de Circuito Impreso Flexibles-Rígidas

New Equipment | Fabrication Services

Fabricante de Placas de Circuito Impreso Flexibles-Rígidas Las placas de circuito impreso (PCB) rígidos-flexibles se fabrican combinando tecnologías de placas rígidas y flexibles. Estas placas de circuito están formadas por múltiples capas internas

Hitech Circuits Co., Limited

NiProTect

New Equipment |  

NiProtect gloves are 4 mil, 100% nitrile ambidextrous design to provide superior tactility, puncture and abrasion resistance and available in 10" or 12" lengths. Applications: EMS Laboratory/Research Patient Examination Precision Parts Handling Proce

MAPA Professional

Electronics Forum: ni, (387)

Solder Ball

Electronics Forum | Mon May 20 09:24:32 EDT 2013 | davef

SAC / Ni interface is the IMC (Cu, Ni)6Sn5

Re: Lead-Free Alloy composition used for leaded IC Packages

Electronics Forum | Tue Aug 22 11:23:40 EDT 2000 | Dr. Ning-Cheng Lee

Plating houses seem to exhibit various results. Unacceptable Ni oxidation levels appear to be related to poor Pd plating processes. Ni oxidation can occur at 3 process stages: 1) prior to the Pd being applied (Ni already oxidized) 2) during the p

Used SMT Equipment: ni, (104)

Samsung CP40L multi-function chip mounter

Samsung CP40L multi-function chip mounter

Used SMT Equipment | Flexible Mounters

Product Name: Samsung CP40L multi-function chip mounter  Product number: CP40L Detailed product introduction Samsung CP40L multi-function chip mounter Mounting head: 3 On the way: linear laser (Ji Guangtou) Substrate size: 460*400*4.2mm Min:50*

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Samsung original CP40L multi-function chip mounter

Samsung original CP40L multi-function chip mounter

Used SMT Equipment | SMT Equipment

Product Name: Samsung CP40L multi-function chip mounter  Product number: CP40L Detailed product introduction Samsung CP40L multi-function chip mounter Mounting head: 3 On the way: linear laser (Ji Guangtou) Substrate size: 460*400*4.2mm Min:50*

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: ni, (156)

Electronics Workbench Announces Multisim 7 and Multicap 7 for Professional Circuit Engineers and Designers

Industry News | 2003-05-06 09:05:12.0

New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance

SMTnet

SMTA Welcomes New Board Members

Industry News | 2022-09-05 07:02:13.0

The SMTA is pleased to announce its election results for the Global Board of Directors for the term beginning September 28, 2022. Martin Anselm, Ph.D., Rochester Institute of Technology was re-elected for a second term as President. Incumbents Julie Silk, Keysight Technologies and Robert Boguski, Datest Corporation, were re-elected and will maintain their positions as VP Tech Programs and VP Membership respectively. Fernando Rueda, KYZEN Corporation, and Patty Chonis, A-Tek LLC, have been newly elected to the Board of Directors.

Surface Mount Technology Association (SMTA)

Parts & Supplies: ni, (111)

Juki National Instruments NI USB 6008 DAQ Cards USB Multifunction Devices

Juki National Instruments NI USB 6008 DAQ Cards USB Multifunction Devices

Parts & Supplies | SMT Equipment

National Instruments NI USB 6008 DAQ Cards USB Multifunction Devices Brand:IN Part Name:DAQ Cards Model:USB 6008 Material:Plastic Box Color:White

KingFei SMT Tech

Technical Library: ni, (20)

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

Technical Library | 2013-08-29 19:52:43.0

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...

Agilent Technologies, Inc.

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

Technical Library | 2012-10-18 21:58:51.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.

Agilent Technologies, Inc.

Videos: ni, (44)

Juki AIR CYLINDER INDER PA0605001A0

Videos

E1378700000   BALL CATCH E1380715000   STICKER E13807260A0   Y AXIS SLIDER ASM E1381726000   LINEAR WAY LWL5 B E1382715000   L STICKER B E1382726000   CHUCK BASE E1383729000   BOARD BASE E1384726000   LM GUIDE RSR92M E13867000A0   HOD BOX ASM

Qinyi Electronics Co.,Ltd

ASM SIPLACE HS60/1034-12032135

Videos

Siemens HS60 parameters Placement head type: 12-nozzle collection and placement head Number of cantilevers: 4 Theoretical mounting rate: 60000cph Component range: 0.6mm x 0.3mm (0201) to 18.7mm x 18.7mm The highest placement accuracy (4 sigma):

Qinyi Electronics Co.,Ltd

Career Center - Resumes: ni, (5)

m.tech in ECE

Career Center | Dehradun, uterakhand India | Research and Development

• Languages:  ASSEMBLY LANGUAGES (8051,8085, 8086), FUNDAMENTALS OF C • Designing Software known: MULTISIM, Project Navigator (VHDL), Mat Lab, PCB Designing, PLC & SCADA, NI VDM- 2009 and NI Lab View- 2009. Area of Interest • Embedded System • M

B.tech_Fresher in Electronics & Communication Engineering

Career Center | Noida, India | Engineering

I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e

Express Newsletter: ni, (24)

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN

Partner Websites: ni, (639)

BPA-NI Coating for Container | Nordson Industrial Coating Systems

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/information/bpa-ni-coating-for-container

BPA-NI Coating for Container | Nordson Industrial Coating Systems Industrial Coating Systems Corporate | Global Directory | Languages Division Only All of Nordson Application Solutions Powder Coating Liquid Painting Container Coating Sealant Adhesive Systems Automotive Assembly UV Curing Systems Industries Aerospace Agriculture

ASYMTEK Products | Nordson Electronics Solutions


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