SMTnet Express, November 24, 2022, Subscribers: 24,902, Companies: 11,662, Users: 27,575 █ Electronics Manufacturing Technical Articles Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for Sn
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) solder is commonly used as lead finish material, which are deposited either by solder plating or solder coating. There are a number of reasons why the Sn/Pb binary system had become a popular choice as lead finish material
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. Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish
