Tiger International(Shanghai)Co.lTD-RiZhao office is one of the largest buyer of non ferrous metal scrap and minerals, esp NiSn scrap,Sn scrap.
Industry Directory | Manufacturer
Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
New Equipment | Solder Materials
We offer Lead Free Solder Wire and Halogen Free Solder Wire; OEM service is available. Alloy / FLUX F4 F10 Sn/Cu v v Sn/Ag v v
New Equipment | Solder Materials
In August 2007, Nihon Superior started simultaneous worldwide sales of SN100C (030) “eCore,” a resin flux cored, lead-free solder product, which contains the newly developed flux that enables the product to display the distinctive features of SN100C
Electronics Forum | Mon Oct 22 05:04:08 EDT 2007 | jkhiew
Hi, Recently we have encountered solder wicking on components termination (total of 13 pcs of components on one pcb)with Ag/Pd finishes during lead-free reflow soldering. The pcb is LF HASL surface finish and LF solder paste composition is SAC305.We
Electronics Forum | Mon Oct 22 20:41:32 EDT 2007 | jkhiew
Hi Dave, The solder has tended to wet the component termination of Ag/Pd (chip capacitor) but has not wetted the pads, whereas the solder has wetted both termination & pads when using Ag/Ni/Sn finishes. Thks
Used SMT Equipment | In-Circuit Testers
Teradyne 8852 fully refurbished. Configuration: Wired for 2560 Test Points 10 x CC2 Cards P/N (048-830-00) 1280 Test Points 1 x High Voltage Prism (051-004-00) Rev W.O 1 x VXI-VP2 32Mb (051-116-01) Rev G 1 x Mini Fib (051-059-00) Rev E 1 x D
Used SMT Equipment | Depanelizers / Routers
Asys ADS 03M Depanelling System with Ruwac Dust collector Model: ADS 03 M Year: 2011 S/N: 041199 - X- and Y-axis with high-end linear motors - Servo-driven Z-axis - Electrically-driven rotary table - Dual station - HMI offers comfortable ope
Industry News | 2018-10-18 08:46:25.0
"Lead-Free" Semiconductor Industry
Industry News | 2018-04-09 19:48:04.0
SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Parts & Supplies | Pick and Place/Feeders
JUKI HM001010010 FAN FILTER Other juki parts: HM000920010 SERVO AMP HM000950010 MOTOR DRIVER HM000960010 GEAR HEAD HM001010010 FAN MOTOR HM001010020 FAN MOTOR HM001220000 MOTOR(41K25RGN-A) HM001220010 GEAR HEAD HM001320000 MOTOR DRIVER HM00
Parts & Supplies | Pick and Place/Feeders
Juki Screw 113X0.5 L8 SM-1030801-SN Juki smt spare parts smt machine 40050244 JUKI 2070/2080 X MOTOR 40053295 JUKI 2070/2080 Y MOTOR 40044534 JUKI 2070/2080 Z MOTOR 40044533 JUKI 2070/2080 T MOTOR 40065497 X_FAN_CON_BRACKET 40065496 X_FAN40_
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2024-06-19 13:59:50.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments:
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
Product name: Solder Bar Product code: NAP100 Alloy composition: Sn/Cu0.7/Ni0.05 Packing: ≈700g/pcs, 20kg/box MOQ: 500KG Price: Contact us for best price Features: - Quality guarantee (R.O.C Patent No.1366495) - No recycle material - Less 20
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force
| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf
| https://pcbasupplies.com/alloy-solder-paste-enig/
. Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish
