Electronics Forum | Thu May 18 11:27:36 EDT 2006 | patrickbruneel
I'm not on the production floor on a daily basis like the other guys here but here's my 2 cents: With a Ni/Au plating the inter-metallic that needs to be formed is Ni/Sn. Ni/Sn inter-metallic requires higher peak assembly temperature and a longer dwe
Electronics Forum | Thu Sep 07 08:50:45 EDT 2006 | Grant
Hi, We have seen a slight rise in failures in a product, and on investigation, the BGA ball has cracked off the PCB. It's below the intermetalic layer in the ball. Reflow otherwise looks good, and the raw components are clean. I am wondering what c
Industry News | 2009-11-06 17:20:54.0
Universal Instruments’ Advanced Process Lab hosted the third 2009 Advanced Research in Electronics Assembly (AREA) Consortium meeting at the Treadway Inn in Owego, NY on October 28-29. More than 75 attendees from the 29 member companies participated in the two-day event and a much larger number has signed up for subsequent webcasts of the presentations. Topics ranged from lead-free solder microstructure and reliability to environmental stress screening procedures.
Industry News | 2010-07-29 15:10:06.0
Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.
Technical Library | 2010-07-08 19:49:59.0
Aging characteristics of new lead free solder alloys are in question by many experts because of higher amount of tin’s effect on the diffusion of other metals, primarily copper, to create undesirable boundary intermetallics over long periods of time and even moderately elevated temperatures. A primary layer of intermetallics, Cu6Sn5 forms as the liquid solder makes contact with the solid copper substrate. This reaction however ceases as the solder temperature falls below that of liquidus. A secondary intermetallic Cu3Sn1, an undesirable weak and brittle layer, is thought to form over time and may be accelerated by even mildly elevated temperatures in electronic modules such as laptops under power. This project was designed to quantify the growth rate of Cu3Sn1 over an extended period of time in a thermal environment similar to a laptop in the power on mode.
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
| http://etasmt.com/te_news_industry/2021-10-14/26961.chtml
. Phenolic resin is resistant to weak acids and weak bases. It will decompose when exposed to strong acids and will corrode when exposed to strong bases
| https://ipcapexexpo.org/media/33/download
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