Electronics Forum: nickel migration (34)

Copper migration

Electronics Forum | Thu Dec 07 07:36:15 EST 2006 | callckq

Hi Davef, The BGA pad is with ENIG finish, the PCB pad is with immersion silver and the solder paste is with SAC type. I already checked, the solder paste Cu is just 0.5%..Hence, I am guessing that copper migration is from PCB pad. No way it is fr

Soldering with Electroless nickel

Electronics Forum | Tue Nov 29 21:51:37 EST 2005 | wmeyers

I have a pin and sleeve assembly that utilizes a fusible link type of solder, Bi, Cd, Pb and Sn alloy. The pin is gold plated, the sleeve is copper alloy 725. I have had sporadic success with wetting of the sleeve during the reflow process. To improv

Industry News: nickel migration (2)

Volunteers Honored for Contributions to IPC and the Electronics Industry Seventy-Five Awards Presented at Fall Standards Development Committee Meetings

Industry News | 2016-09-29 20:30:17.0

IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on September 26 at IPC's Fall Standards Development Committee Meetings in Rosemont, Ill. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.

Association Connecting Electronics Industries (IPC)

What's happening at Nihon Superior in 2008?

Industry News | 2008-03-25 23:59:52.0

Comment from Tetsuro Nishimura, North American Sales Manager

Nihon Superior Co., Ltd.

Technical Library: nickel migration (1)

Soldering to Gold Over Nickel Surfaces

Technical Library | 1999-05-07 11:28:39.0

There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold.

Kester

Express Newsletter: nickel migration (54)

Partner Websites: nickel migration (7)

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

) Branch or snowflake-like patterns of metal that grow on surfaces between conductors. It requires a chemical reaction capable of dissolving the metal into a solution of metal ions, which are then redeposited by electro-migration in the presence of an electromagnetic field

ASYMTEK Products | Nordson Electronics Solutions


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