Industry Directory | Manufacturer
We guarentee to lower your product cost! With over 15 years experience, we are DIRECT CONTACTS of select Asian manufacturing companies and factories from The People's Republic of China, Philippines, and Hong Kong. This select group is well-established manufacturing experts within their industries. We have long term relations with each
NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for
New Equipment | Solder Materials
KappRad has been developed specifically to join and repair Aluminum and Aluminum Copper radiators and heat exchangers. A lower melting point makes delicate repair work easier. Matching KAPP Golden Flux acts as a temperature guide to ensure simple app
Electronics Forum | Tue Apr 22 08:55:54 EDT 2014 | davef
I assume that you're talking about wanting to solder to metal tabs that are spot welded to the battery terminal. These tabs are not meant to be soldered. The metal was special selected for welding. In the old days, you could buy plumbing flux at th
Electronics Forum | Sun Apr 05 00:23:53 EDT 2020 | researchmfg
1. To protect the nickel and copper under gold plating from oxidization before soldering. Gold plating can extend the PCB self-life and improve the solderability for 2nd re-flow. 2. Provide a good bonding strength. For Chip on Board process that Gol
Industry News | 2016-03-22 16:48:06.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the Las Vegas Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Industry News | 2013-02-20 18:54:10.0
IPC — Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center.
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
Technical Library | 1999-05-07 11:28:39.0
There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold.
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
SMTnet Express, September 7, 2017, Subscribers: 30,782, Members: Companies: 10,712, Users: 23,761 Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift Young K. Song and Vanja Bukva; Teledyne DALSA As a surface finish for PCBs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/heat-treatments
. The bond of this electroplating is usually not sufficient for screws. The better method, electroless nickel plating, gives an alloy of nickel with up to 15% phosphorous
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
al. Abstract 17-2 IMPACTS OF BULK PHOSPHOROUS CONTENT OF ELECTROLESS NICKEL LAYERS TO SOLDER JOINT INTEGRITY AND THEIR USE AS GOLD- AND ALUMINUM-WIRE BOND SURFACES Kuldip Johal and Hugh Roberts et al. Abstract 17-2 ELECTROCHEMICAL MIGRATION ON HASL
